Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
P80C32UFAA,512P80C32UFAA,512NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
33MHz
Connectivity:
UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
525
P80C32UFAA,518P80C32UFAA,518NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
33MHz
Connectivity:
UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,979
P80C32UFBB,557P80C32UFBB,557NXP SemiconductorsIC MCU 8BIT ROMLESS 44PQFPMicrocontrollers44-PQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
33MHz
Connectivity:
UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PQFP (10×10)
Package / Case:
44-QFP
659
P80C32X2BA,512P80C32X2BA,512NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,602
P80C32X2BBD,157P80C32X2BBD,157NXP SemiconductorsIC MCU 8BIT ROMLESS 44LQFPMicrocontrollers44-LQFP (10x10)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
606
P80C32X2FA,512P80C32X2FA,512NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
260
P80C32X2FN,112P80C32X2FN,112NXP SemiconductorsIC MCU 8BIT ROMLESS 40DIPMicrocontrollers40-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-DIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
845
P80C51FA-4A,512P80C51FA-4A,512NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR, PWM
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,005
P80C51FA-4B,557P80C51FA-4B,557NXP SemiconductorsIC MCU 8BIT ROMLESS 44PQFPMicrocontrollers44-PQFP (10x10)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR, PWM
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PQFP (10×10)
Package / Case:
44-QFP
971
P80C51FA-4N,112P80C51FA-4N,112NXP SemiconductorsIC MCU 8BIT ROMLESS 40DIPMicrocontrollers40-DIPN/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR, PWM
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-DIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
405
P80C552EBA/08,512P80C552EBA/08,512NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.18x24.18)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
40
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.18×24.18)
Package / Case:
68-LCC (J-Lead)
463
P80C552EBA/08,518P80C552EBA/08,518NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.18x24.18)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
40
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.18×24.18)
Package / Case:
68-LCC (J-Lead)
731
P80C552EBB/08,557P80C552EBB/08,557NXP SemiconductorsIC MCU 8BIT ROMLESS 80PQFPMicrocontrollers80-PQFP (14x20)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
40
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-PQFP (14×20)
Package / Case:
80-BQFP
1,076
P80C552EFA/08,512P80C552EFA/08,512NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.18x24.18)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
40
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.18×24.18)
Package / Case:
68-LCC (J-Lead)
1,487
P80C552EFA/08,518P80C552EFA/08,518NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.18x24.18)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
40
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.18×24.18)
Package / Case:
68-LCC (J-Lead)
527
P80C552EFB/08,557P80C552EFB/08,557NXP SemiconductorsIC MCU 8BIT ROMLESS 80PQFPMicrocontrollers80-PQFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
40
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-PQFP (14×20)
Package / Case:
80-BQFP
87
P80C552IBA/08,512P80C552IBA/08,512NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.18x24.18)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
40
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.18×24.18)
Package / Case:
68-LCC (J-Lead)
200
P80C552IBA/08,518P80C552IBA/08,518NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.18x24.18)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
40
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.18×24.18)
Package / Case:
68-LCC (J-Lead)
1,737
P80C552IFA/08,512P80C552IFA/08,512NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.18x24.18)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
40
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.18×24.18)
Package / Case:
68-LCC (J-Lead)
633
P80C554SBBD,157P80C554SBBD,157NXP SemiconductorsIC MCU 8BIT ROMLESS 64LQFPMicrocontrollers64-LQFP (10x10)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
40
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,027

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