 | | P80C32UFAA,512 | NXP Semiconductors | IC MCU 8BIT ROMLESS 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 525 | |
 | | P80C32UFAA,518 | NXP Semiconductors | IC MCU 8BIT ROMLESS 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 1,979 | |
 | | P80C32UFBB,557 | NXP Semiconductors | IC MCU 8BIT ROMLESS 44PQFP | Microcontrollers | 44-PQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PQFP (10×10) | 659 | |
 | | P80C32X2BA,512 | NXP Semiconductors | IC MCU 8BIT ROMLESS 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 1,602 | |
 | | P80C32X2BBD,157 | NXP Semiconductors | IC MCU 8BIT ROMLESS 44LQFP | Microcontrollers | 44-LQFP (10x10) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-LQFP (10×10) | 606 | |
 | | P80C32X2FA,512 | NXP Semiconductors | IC MCU 8BIT ROMLESS 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 260 | |
 | | P80C32X2FN,112 | NXP Semiconductors | IC MCU 8BIT ROMLESS 40DIP | Microcontrollers | 40-DIP | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 40-DIP Package / Case: 40-DIP (0.600″”, 15.24mm) | 845 | |
 | | P80C51FA-4A,512 | NXP Semiconductors | IC MCU 8BIT ROMLESS 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 1,005 | |
 | | P80C51FA-4B,557 | NXP Semiconductors | IC MCU 8BIT ROMLESS 44PQFP | Microcontrollers | 44-PQFP (10x10) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PQFP (10×10) | 971 | |
 | | P80C51FA-4N,112 | NXP Semiconductors | IC MCU 8BIT ROMLESS 40DIP | Microcontrollers | 40-DIP | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 40-DIP Package / Case: 40-DIP (0.600″”, 15.24mm) | 405 | |
 | | P80C552EBA/08,512 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.18x24.18) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.18×24.18) Package / Case: 68-LCC (J-Lead) | 463 | |
 | | P80C552EBA/08,518 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.18x24.18) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.18×24.18) Package / Case: 68-LCC (J-Lead) | 731 | |
 | | P80C552EBB/08,557 | NXP Semiconductors | IC MCU 8BIT ROMLESS 80PQFP | Microcontrollers | 80-PQFP (14x20) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-PQFP (14×20) | 1,076 | |
 | | P80C552EFA/08,512 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.18x24.18) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.18×24.18) Package / Case: 68-LCC (J-Lead) | 1,487 | |
 | | P80C552EFA/08,518 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.18x24.18) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.18×24.18) Package / Case: 68-LCC (J-Lead) | 527 | |
 | | P80C552EFB/08,557 | NXP Semiconductors | IC MCU 8BIT ROMLESS 80PQFP | Microcontrollers | 80-PQFP (14x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-PQFP (14×20) | 87 | |
 | | P80C552IBA/08,512 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.18x24.18) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.18×24.18) Package / Case: 68-LCC (J-Lead) | 200 | |
 | | P80C552IBA/08,518 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.18x24.18) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.18×24.18) Package / Case: 68-LCC (J-Lead) | 1,737 | |
 | | P80C552IFA/08,512 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.18x24.18) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.18×24.18) Package / Case: 68-LCC (J-Lead) | 633 | |
 | | P80C554SBBD,157 | NXP Semiconductors | IC MCU 8BIT ROMLESS 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 7x10b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,027 | |