 | | P89V660FA,512 | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 661 | |
 | | P89V660FBC,557 | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 44TQFP | Microcontrollers | 44-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-TQFP (10×10) | 339 | |
 | | P89V662FA,512 | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 137 | |
 | | P89V662FBC,557 | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 44TQFP | Microcontrollers | 44-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-TQFP (10×10) | 942 | |
 | | P89V664FA,512 | NXP Semiconductors | IC MCU 8BIT 64KB FLASH 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 492 | |
 | | P89V664FBC,557 | NXP Semiconductors | IC MCU 8BIT 64KB FLASH 44TQFP | Microcontrollers | 44-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-TQFP (10×10) | 86 | |
| N/A | N/A | PAS5201-A0 | Microchip Technology | IC SYSTEM ON CHIP ETHERNET | Controllers | - | - | – | Interface: Ethernet, GPIO, UART | 1,296 | |
| N/A | N/A | PAS5201-L0 | Microchip Technology | IC ETHERNET MAC CNTRLR | Controllers | - | - | – | Interface: Ethernet, GPIO, UART | 1,914 | |
| N/A | N/A | PAS5211A-F3EI | Microchip Technology | FOUR-PORT GPON OLT SOC | Controllers | - | - | – | N/A | 457 | |
| N/A | N/A | PAS6511B-F3EI | Microchip Technology | IC SYSTEM ON CHIP ETHERNET | Controllers | 336-FCBGA (17x17) | - | – | Standards: IEEE 802.3, 10/100/1000 Base-T PHY Package / Case: 336-BGA, FCBGA Supplier Device Package: 336-FCBGA (17×17) | 856 | |
| N/A | N/A | PAS6511B-F3GI | Microchip Technology | IC ETHERNET I2C/MII/SPI 336FCBGA | Controllers | 336-FCBGA (17x17) | - | – | Standards: 10/100/1000 Base-T PHY Package / Case: 336-BGA, FCBGA Supplier Device Package: 336-FCBGA (17×17) | 468 | |
| N/A | N/A | PAS6512B-F3GI | Microchip Technology | IC ETHERNET I2C/MII/SPI 336FCBGA | Controllers | 336-FCBGA (17x17) | - | – | Standards: 10/100/1000 Base-T PHY Package / Case: 336-BGA, FCBGA Supplier Device Package: 336-FCBGA (17×17) | 157 | |
| N/A | N/A | PAS7400B-NGI | Microchip Technology | IC ETHERNET MII 384FCBGA | Controllers | 384-FCBGA (17x17) | - | – | Package / Case: 384-BGA, FCBGA Supplier Device Package: 384-FCBGA (17×17) | 830 | |
| N/A | N/A | PAS7401B-PGI | Microchip Technology | IC SYSTEM ON CHIP ETHERNET | Controllers | 416-HBGA (27x27) | - | – | Interface: JTAG, MII, SPI, UART Supplier Device Package: 416-HBGA (27×27) | 1,801 | |
 | N/A | PC56F84550VLF | NXP Semiconductors | IC MCU 32BIT 96KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 10x12b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 386 | |
 | N/A | PC56F84763VLH | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 16x12b, 8x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 367 | |
 | N/A | PC56F84786VLK | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 80FQFP | Microcontrollers | 80-FQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 16x12b, 10x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-FQFP (12×12) | 191 | |
 | N/A | PC56F84789VLL | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 16x12b, 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 386 | |
 | | PC82562EP | Intel | LAN CONTROLLER, PBGA64 | Controllers | 64-BGA | N/A | N/A | Supplier Device Package: 64-BGA | 1,120 | |
 | | PC9RS08KA2DWE | NXP Semiconductors | IC MCU 8BIT 2KB FLASH 8SO | Microcontrollers | 8-SO | N/A | 0°C ~ 70°C (TA) | Peripherals: LVD, POR, WDT Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SO Package / Case: 8-SOIC (0.209″”, 5.30mm Width) | 2 | |