Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
PIC24FJ64GC010-I/PTPIC24FJ64GC010-I/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 50x12b, 2x16b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
706
PIC24FJ64GC010T-I/BGPIC24FJ64GC010T-I/BGMicrochip TechnologyIC MCU 16BIT 64KB FLASH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 50x12b, 2x16b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
496
PIC24FJ64GC010T-I/PTPIC24FJ64GC010T-I/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 50x12b, 2x16b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
63
PIC24FJ64GL302-E/MLPIC24FJ64GL302-E/MLMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28QFNMicrocontrollers28-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (6×6)
Package / Case:
28-VQFN Exposed Pad
331
PIC24FJ64GL302-E/MVPIC24FJ64GL302-E/MVMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28UQFNMicrocontrollers28-UQFN (4x4)N/A-40°C ~ 125°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-UQFN (4×4)
Package / Case:
28-UFQFN Exposed Pad
1,285
PIC24FJ64GL302-E/SOPIC24FJ64GL302-E/SOMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,471
PIC24FJ64GL302-E/SSPIC24FJ64GL302-E/SSMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28SSOPMicrocontrollers28-SSOPN/A-40°C ~ 125°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SSOP
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
1,453
PIC24FJ64GL302-I/MLPIC24FJ64GL302-I/MLMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28QFNMicrocontrollers28-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (6×6)
Package / Case:
28-VQFN Exposed Pad
592
PIC24FJ64GL302-I/MVPIC24FJ64GL302-I/MVMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28UQFNMicrocontrollers28-UQFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-UQFN (4×4)
Package / Case:
28-UFQFN Exposed Pad
1,963
PIC24FJ64GL302-I/SOPIC24FJ64GL302-I/SOMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,357
PIC24FJ64GL302-I/SSPIC24FJ64GL302-I/SSMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28SSOPMicrocontrollers28-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SSOP
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
478
PIC24FJ64GL302T-I/MLPIC24FJ64GL302T-I/MLMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28QFNMicrocontrollers28-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (6×6)
Package / Case:
28-VQFN Exposed Pad
337
PIC24FJ64GL302T-I/MVPIC24FJ64GL302T-I/MVMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28UQFNMicrocontrollers28-UQFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-UQFN (4×4)
Package / Case:
28-UFQFN Exposed Pad
374
PIC24FJ64GL302T-I/SOPIC24FJ64GL302T-I/SOMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
773
PIC24FJ64GL302T-I/SSPIC24FJ64GL302T-I/SSMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28SSOPMicrocontrollers28-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 9×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SSOP
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
660
PIC24FJ64GL303-E/M5PIC24FJ64GL303-E/M5Microchip TechnologyIC MCU 16BIT 64KB FLASH 36UQFNMicrocontrollers36-UQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
29
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 11×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
36-UQFN (5×5)
Package / Case:
36-UFQFN Exposed Pad
1,092
PIC24FJ64GL303-I/M5PIC24FJ64GL303-I/M5Microchip TechnologyIC MCU 16BIT 64KB FLASH 36UQFNMicrocontrollers36-UQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
29
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 11×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
36-UQFN (5×5)
Package / Case:
36-UFQFN Exposed Pad
719
PIC24FJ64GL303T-I/M5PIC24FJ64GL303T-I/M5Microchip TechnologyIC MCU 16BIT 64KB FLASH 36UQFNMicrocontrollers36-UQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
29
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 11×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
36-UQFN (5×5)
Package / Case:
36-UFQFN Exposed Pad
1,533
PIC24FJ64GL305-E/M4PIC24FJ64GL305-E/M4Microchip TechnologyIC MCU 16BIT 64KB FLASH 48UQFNMicrocontrollers48-UQFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
39
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 12×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-UQFN (6×6)
Package / Case:
48-UFQFN Exposed Pad
666
PIC24FJ64GL305-E/PTPIC24FJ64GL305-E/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 48TQFPMicrocontrollers48-TQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
PIC
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
39
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 12×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-TQFP (7×7)
Package / Case:
48-TQFP
114

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