Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/APIC32CK1025GC01064-I/3ZBMicrochip TechnologyM33 1MB/256 64 TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
913
N/APIC32CK1025GC01100-I/4SBMicrochip TechnologyM33 1MB/256 100 TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
72
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 15x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
1,041
N/APIC32CK1025GC01144-I/4KBMicrochip TechnologyM33 1MB/256 144 TQFPMicrocontrollers144-TQFP (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
108
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 15x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP Exposed Pad
373
N/APIC32CK1025SG01064-I/3ZB-SL3Microchip TechnologyM33 HSM 1MB/256 64 TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
252
N/APIC32CK1025SG01100-I/4SB-SL3Microchip TechnologyM33 HSM 1MB/256 100 TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
72
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 15x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
671
N/APIC32CK1025SG01144-I/4KB-SL3Microchip TechnologyM33 HSM 1MB/256 144 TQFPMicrocontrollers144-TQFP (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
108
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 15x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP Exposed Pad
617
N/APIC32CK2051GC01064-I/3ZBMicrochip TechnologyM33 2MB/512 64 TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
50
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
372
N/APIC32CK2051GC01064-I/3ZB-SL3Microchip TechnologyM33 2MB/512 64 TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
50
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
1,103
N/APIC32CK2051GC01100-I/4SBMicrochip TechnologyM33 2MB/512 100 TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
72
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 15x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
456
N/APIC32CK2051GC01100-I/4SB-SL3Microchip TechnologyM33 2MB/512 100 TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
72
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 15x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
879
N/APIC32CK2051GC01144-I/4KBMicrochip TechnologyM33 2MB/512 144 TQFPMicrocontrollers144-TQFP (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
108
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 15x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP Exposed Pad
295
N/APIC32CK2051GC01144-I/4KB-SL3Microchip TechnologyM33 2MB/512 144 TQFPMicrocontrollers144-TQFP (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
108
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 15x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP Exposed Pad
1,860
N/APIC32CK2051SG01064-I/3ZB-SL3Microchip TechnologyM33 HSM 2MB/512 64 TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
50
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
301
N/APIC32CK2051SG01100-I/4SB-SL3Microchip TechnologyM33 HSM 2MB/512 100 TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
72
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 15x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
1,974
N/APIC32CK2051SG01144-I/4KB-SL3Microchip TechnologyM33 HSM 2MB/512 144 TQFPMicrocontrollers144-TQFP (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
108
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 15x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP Exposed Pad
1,101
PIC32CM1216MC00032-E/PTPIC32CM1216MC00032-E/PTMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32TQFPMicrocontrollers32-TQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, RS-485, SERCOM, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 14x12b, 1x16b Sigma-Delta; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFP (7×7)
Package / Case:
32-TQFP
1,815
PIC32CM1216MC00032-E/RTBPIC32CM1216MC00032-E/RTBMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32VFQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, RS-485, SERCOM, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 14x12b, 1x16b Sigma-Delta; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
317
PIC32CM1216MC00032-I/PTPIC32CM1216MC00032-I/PTMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32TQFPMicrocontrollers32-TQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, RS-485, SERCOM, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 14x12b, 1x16b Sigma-Delta; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFP (7×7)
Package / Case:
32-TQFP
1,722
PIC32CM1216MC00032-I/RTBPIC32CM1216MC00032-I/RTBMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, RS-485, SERCOM, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 14x12b, 1x16b Sigma-Delta; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
140
PIC32CM1216MC00032T-E/PTPIC32CM1216MC00032T-E/PTMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32TQFPMicrocontrollers32-TQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, RS-485, SERCOM, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 14x12b, 1x16b Sigma-Delta; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFP (7×7)
Package / Case:
32-TQFP
1,211

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