Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
PIC32CX1025SG41128T-I/Z2XPIC32CX1025SG41128T-I/Z2XMicrochip TechnologyIC MCU 32BIT 1MB FLASH 128TQFPMicrocontrollers128-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, POR, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
99
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 32x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-TQFP (14×14)
Package / Case:
128-TQFP
275
PIC32CX2051MTC128T-I/X9BN/APIC32CX2051MTC128T-I/X9BMicrochip TechnologyIC MCU 32BIT 2MB FLASH 128TQFPMicrocontrollers128-TQFP-EP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
Flexcomm, I2C, IrDA, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number of I/O:
102
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-TQFP-EP (14×14)
Package / Case:
128-TQFP Exposed Pad
233
PIC32CX2051MTG128T-I/X9BN/APIC32CX2051MTG128T-I/X9BMicrochip TechnologySINGLE CORE, 2MB FLASH, 512KB SRMicrocontrollers128-TQFP-EP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
Flexcomm, I2C, IrDA, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number of I/O:
102
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-TQFP-EP (14×14)
Package / Case:
128-TQFP Exposed Pad
1,313
N/APIC32CX5109BZ31048T-V/ZWXMicrochip Technology64MHZ CM4F CORE WITH INTEGRATEDMicrocontrollersN/AN/AN/A

N/A

1,450
N/AN/APIC32CX5112MTC128-I/X9BMicrochip TechnologyIC MCU 32BIT 512KB FLASH 128TQFPMicrocontrollersN/AN/AN/A

N/A

307
N/AN/APIC32CX5112MTC128T-I/X9BMicrochip TechnologyIC MCU 32BIT 512KB FLASH 128TQFPMicrocontrollersN/AN/AN/A

N/A

1,893
N/AN/APIC32CX5112MTG128-I/X9BMicrochip TechnologySINGLE CORE, 512KB FLASH, 128KBMicrocontrollersN/AN/AN/A

N/A

1,371
N/AN/APIC32CX5112MTG128T-I/X9BMicrochip TechnologySINGLE CORE, 512KB FLASH, 128KBMicrocontrollersN/AN/AN/A

N/A

1,338
PIC32CZ4010CA80208-I/8MXPIC32CZ4010CA80208-I/8MXMicrochip TechnologyIC MCU 32BIT 4MB FLASH 208TFBGAMicrocontrollersN/AN/AN/A

N/A

187
PIC32CZ4010CA90208-I/8MX-SL3PIC32CZ4010CA90208-I/8MX-SL3Microchip TechnologyIC MCU 32BIT 4MB FLASH 208TFBGAMicrocontrollersN/AN/AN/A

N/A

366
PIC32CZ8110CA80208-I/8MXPIC32CZ8110CA80208-I/8MXMicrochip TechnologyIC MCU 32BIT 8MB FLASH 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
157
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.75V ~ 3.63V
Data Converters:
A/D 36x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
657
PIC32CZ8110CA80208-I/8MX-SL3PIC32CZ8110CA80208-I/8MX-SL3Microchip TechnologyIC MCU 32BIT 8MB FLASH 208TFBGAMicrocontrollersN/AN/AN/A

N/A

642
PIC32CZ8110CA90208-I/8MX-SL3PIC32CZ8110CA90208-I/8MX-SL3Microchip TechnologyIC MCU 32BIT 8MB FLASH 208TFBGAMicrocontrollersN/AN/AN/A

N/A

773
PIC32MK0128MCA028-E/N2XPIC32MK0128MCA028-E/N2XMicrochip TechnologyIC MCU 32BIT 128KB FLASH 28SSOPMicrocontrollers28-SSOPN/A-40°C ~ 125°C (TA)
Core Processor:
MIPS32® microAptiv™
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.3V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SSOP
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
198
PIC32MK0128MCA028-I/N2XPIC32MK0128MCA028-I/N2XMicrochip TechnologyIC MCU 32BIT 128KB FLASH 28SSOPMicrocontrollers28-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MIPS32® microAptiv™
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.3V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SSOP
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
506
PIC32MK0128MCA028T-E/N2XPIC32MK0128MCA028T-E/N2XMicrochip TechnologyIC MCU 32BIT 128KB FLASH 28SSOPMicrocontrollers28-SSOPN/A-40°C ~ 125°C (TA)
Core Processor:
MIPS32® microAptiv™
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.3V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SSOP
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
209
PIC32MK0128MCA028T-I/N2XPIC32MK0128MCA028T-I/N2XMicrochip TechnologyIC MCU 32BIT 128KB FLASH 28SSOPMicrocontrollers28-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MIPS32® microAptiv™
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.3V ~ 3.6V
Data Converters:
A/D 10x12b SAR; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SSOP
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
838
PIC32MK0128MCA032-E/RTBPIC32MK0128MCA032-E/RTBMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
MIPS32® microAptiv™
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.3V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
69
PIC32MK0128MCA032-I/RTBPIC32MK0128MCA032-I/RTBMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MIPS32® microAptiv™
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.3V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
535
PIC32MK0128MCA032T-E/RTBPIC32MK0128MCA032T-E/RTBMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
MIPS32® microAptiv™
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.3V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
307

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