 | | PIC32MZ1064DAL169-V/HF | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 141 | |
 | | PIC32MZ1064DAL169T-I/HF | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 494 | |
 | | PIC32MZ1064DAL169T-V/HF | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 153 | |
 | | PIC32MZ1064DAL176-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 570 | |
 | | PIC32MZ1064DAL176-V/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 458 | |
 | | PIC32MZ1064DAL176T-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 181 | |
 | | PIC32MZ1064DAL176T-V/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 799 | |
 | | PIC32MZ1064DAR169-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 581 | |
 | | PIC32MZ1064DAR169-V/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 478 | |
 | | PIC32MZ1064DAR169T-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,266 | |
 | | PIC32MZ1064DAR169T-V/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 49 | |
 | | PIC32MZ1064DAR176-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 536 | |
 | | PIC32MZ1064DAR176-V/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 526 | |
 | | PIC32MZ1064DAR176T-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 549 | |
 | | PIC32MZ1064DAR176T-V/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 354 | |
 | | PIC32MZ1064DAS169-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 601 | |
 | | PIC32MZ1064DAS169-V/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 580 | |
 | | PIC32MZ1064DAS169T-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,044 | |
 | | PIC32MZ1064DAS169T-V/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 560 | |
 | | PIC32MZ1064DAS176-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 640K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 498 | |