Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R5F11ZBADFP#50R5F11ZBADFP#50RenesasIC MCU 16BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
1.5K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8×8/12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,966
R5F11ZBADFP#70R5F11ZBADFP#70Renesas16-BIT GENERAL MCU RL78/G1P 16KMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
1.5K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8×8/12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
603
N/AR5F12007ANS#10Renesas16BIT MCU RL78/G15 4K 8WDFN -40Microcontrollers8-HWSON (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
142
N/AR5F12007ANS#30RenesasIC MCU 16BIT 4KB FLASH 8WDFNMicrocontrollers8-HWSON (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
557
N/AR5F12007ANS#50Renesas16BIT MCU RL78/G15 4K 8WDFN -40Microcontrollers8-HWSON (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
328
N/AR5F12007ANS#70Renesas16BIT MCU RL78/G15 4K 8WDFN -40/Microcontrollers8-HWSON (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
782
N/AR5F12007GNS#10Renesas16BIT MCU RL78/G15 4K 8WDFN -40Microcontrollers8-HWSON (3x3)N/A-40°C ~ 105°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
1,415
N/AR5F12007GNS#30RenesasIC MCU 16BIT 4KB FLASH 8WDFNMicrocontrollers8-HWSON (3x3)N/A-40°C ~ 105°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
864
N/AR5F12007GNS#50Renesas16BIT MCU RL78/G15 4K 8WDFN -40Microcontrollers8-HWSON (3x3)N/A-40°C ~ 105°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
379
N/AR5F12007GNS#70Renesas16BIT MCU RL78/G15 4K 8WDFN -40/Microcontrollers8-HWSON (3x3)N/A-40°C ~ 105°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
935
N/AR5F12007MNS#10Renesas16BIT MCU RL78/G15 4K 8WDFN -40Microcontrollers8-HWSON (3x3)N/A-40°C ~ 125°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
971
N/AR5F12007MNS#30RenesasIC MCU 16BIT 4KB FLASH 8WDFNMicrocontrollers8-HWSON (3x3)N/A-40°C ~ 125°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
1,319
N/AR5F12007MNS#50Renesas16BIT MCU RL78/G15 4K 8WDFN -40Microcontrollers8-HWSON (3x3)N/A-40°C ~ 125°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
52
N/AR5F12007MNS#70Renesas16BIT MCU RL78/G15 4K 8WDFN -40/Microcontrollers8-HWSON (3x3)N/A-40°C ~ 125°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
217
N/AR5F12008ANS#10Renesas16BIT MCU RL78/G15 8K 8WDFN -40Microcontrollers8-HWSON (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
48
N/AR5F12008ANS#30RenesasIC MCU 16BIT 8KB FLASH 8WDFNMicrocontrollers8-HWSON (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
192
N/AR5F12008ANS#50Renesas16BIT MCU RL78/G15 8K 8WDFN -40Microcontrollers8-HWSON (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
181
N/AR5F12008ANS#70Renesas16BIT MCU RL78/G15 8K 8WDFN -40/Microcontrollers8-HWSON (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
1,893
N/AR5F12008GNS#10Renesas16BIT MCU RL78/G15 8K 8WDFN -40Microcontrollers8-HWSON (3x3)N/A-40°C ~ 105°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
234
N/AR5F12008GNS#30RenesasIC MCU 16BIT 8KB FLASH 8WDFNMicrocontrollers8-HWSON (3x3)N/A-40°C ~ 105°C (TA)
Core Processor:
RL78
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
5
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 3×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (3×3)
Package / Case:
8-WDFN Exposed Pad
775

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