Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R5F52317BDNE#U0R5F52317BDNE#U0RenesasIC MCU 32BIT 384KB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
1,125
R5F52317BGFL#10R5F52317BGFL#10RenesasIC MCU 32BIT 384KB FLASH 48LQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
739
R5F52317BGFL#30R5F52317BGFL#30RenesasIC MCU 32BIT 384KB FLASH 48LQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
1,455
R5F52317BGFM#10R5F52317BGFM#10RenesasIC MCU 32BIT 384KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
446
R5F52317BGFM#30R5F52317BGFM#30RenesasIC MCU 32BIT 384KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
519
R5F52317BGFP#10N/AR5F52317BGFP#10RenesasIC MCU 32BIT 384KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 24x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
775
R5F52317BGFP#30R5F52317BGFP#30RenesasIC MCU 32BIT 384KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 24x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
570
R5F52317BGND#00R5F52317BGND#00RenesasIC MCU 32BIT 384KB FLASH 64WFQFNMicrocontrollers64-HWQFN (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (9×9)
Package / Case:
64-WFQFN Exposed Pad
127
R5F52317BGND#20R5F52317BGND#20RenesasIC MCU 32BIT 384KB FLASH 64HWQFNMicrocontrollers64-HWQFN (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (9×9)
Package / Case:
64-WFQFN Exposed Pad
1,183
R5F52317BGND#40R5F52317BGND#40RenesasIC MCU 32BIT 384KB FLASH 64WFQFNMicrocontrollers64-HWQFN (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (9×9)
Package / Case:
64-WFQFN Exposed Pad
1,527
R5F52317BGND#U0R5F52317BGND#U0RenesasIC MCU 32BIT 384KB FLASH 64HWQFNMicrocontrollers64-HWQFN (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HWQFN (9×9)
Package / Case:
64-WFQFN Exposed Pad
272
R5F52317BGNE#00R5F52317BGNE#00RenesasIC MCU 32BIT 384KB FLASH 48WFQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
311
R5F52317BGNE#20R5F52317BGNE#20RenesasIC MCU 32BIT 384KB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
659
R5F52317BGNE#40R5F52317BGNE#40RenesasIC MCU 32BIT 384KB FLASH 48WFQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
157
R5F52317BGNE#U0R5F52317BGNE#U0RenesasIC MCU 32BIT 384KB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
1,146
R5F52318ADFL#10R5F52318ADFL#10RenesasIC MCU 32BIT 512KB FLASH 48LFQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
1,861
R5F52318ADFL#30R5F52318ADFL#30RenesasIC MCU 32BIT 512KB FLASH 48LFQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
712
R5F52318ADFM#10R5F52318ADFM#10RenesasIC MCU 32BIT 512KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,358
R5F52318ADFM#30R5F52318ADFM#30RenesasIC MCU 32BIT 512KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,488
R5F52318ADFP#10R5F52318ADFP#10RenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
EBI/EMI, I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 24x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
180

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