Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R5F523T5ADFM#50R5F523T5ADFM#50RenesasIC MCU 32BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
RX
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
660
R5F523T5AGFD#10R5F523T5AGFD#10RenesasIC MCU 32BIT 128MB FLASH 52LQFPMicrocontrollers52-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RX
Core Size:
32-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-LQFP (10×10)
Package / Case:
52-LQFP
1,751
R5F523T5AGFD#30R5F523T5AGFD#30RenesasIC MCU 32BIT 128KB FLASH 52LQFPMicrocontrollers52-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RX
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-LQFP (10×10)
Package / Case:
52-LQFP
73
R5F523T5AGFD#50R5F523T5AGFD#50RenesasIC MCU 32BIT 128MB FLASH 52LQFPMicrocontrollers52-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RX
Core Size:
32-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-LQFP (10×10)
Package / Case:
52-LQFP
645
R5F523T5AGFL#10R5F523T5AGFL#10RenesasIC MCU 32BIT 128MB FLASH 48LQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RX
Core Size:
32-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
486
R5F523T5AGFL#30R5F523T5AGFL#30RenesasIC MCU 32BIT 128KB FLASH 48LFQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RX
Core Size:
32-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
1,764
R5F523T5AGFL#50R5F523T5AGFL#50RenesasIC MCU 32BIT 128MB FLASH 48LQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RX
Core Size:
32-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
99
R5F523T5AGFM#10N/AR5F523T5AGFM#10RenesasIC MCU 32BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RX
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
933
R5F523T5AGFM#30R5F523T5AGFM#30RenesasIC MCU 32BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RX
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
524
R5F523T5AGFM#50R5F523T5AGFM#50RenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RX
Core Size:
32-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
6
R5F523W7ADBL#20R5F523W7ADBL#20RenesasIC MCU 32BIT 384KB FLASH 85TFBGAMicrocontrollers85-TFBGA (5.5x5.5)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
85-TFBGA (5.5×5.5)
Package / Case:
85-TFBGA
94
R5F523W7ADNG#30R5F523W7ADNG#30RenesasIC MCU 32BIT 384KB FLASH 56VFQFNMicrocontrollers56-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-HVQFN (7×7)
Package / Case:
56-VFQFN Exposed Pad
913
R5F523W7BDBL#20R5F523W7BDBL#20RenesasIC MCU 32BIT 384KB FLASH 85TFBGAMicrocontrollers85-TFBGA (5.5x5.5)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
85-TFBGA (5.5×5.5)
Package / Case:
85-TFBGA
249
R5F523W7BDNG#30R5F523W7BDNG#30RenesasIC MCU 32BIT 384KB FLASH 56VFQFNMicrocontrollers56-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-HVQFN (7×7)
Package / Case:
56-VFQFN Exposed Pad
1,069
R5F523W8ADBL#20R5F523W8ADBL#20RenesasIC MCU 32BIT 512KB FLASH 85TFBGAMicrocontrollers85-TFBGA (5.5x5.5)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
85-TFBGA (5.5×5.5)
Package / Case:
85-TFBGA
1,152
R5F523W8ADNG#30R5F523W8ADNG#30RenesasIC MCU 32BIT 512KB FLASH 56HVQFNMicrocontrollers56-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-HVQFN (7×7)
Package / Case:
56-VFQFN Exposed Pad
131
R5F523W8BDBL#20R5F523W8BDBL#20RenesasIC MCU 32BIT 512KB FLASH 85TFBGAMicrocontrollers85-TFBGA (5.5x5.5)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
85-TFBGA (5.5×5.5)
Package / Case:
85-TFBGA
156
R5F523W8BDNG#30R5F523W8BDNG#30RenesasIC MCU 32BIT 512KB FLASH 56HVQFNMicrocontrollers56-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-HVQFN (7×7)
Package / Case:
56-VFQFN Exposed Pad
325
N/AR5F523W8CDLN#20Renesas32BIT MCU RX23W MODULEMicrocontrollers83-TFLGA (9.5x6.1)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 14x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
83-TFLGA (9.5×6.1)
Package / Case:
83-TFLGA
801
R5F523W8CDLN#U0R5F523W8CDLN#U0RenesasIC MCU 32BIT 512KB FLASH 83TFLGAMicrocontrollers83-TFLGA (9.5x6.1)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
83-TFLGA (9.5×6.1)
Package / Case:
83-TFLGA
1,734

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