Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R5F564MLCDFC#11R5F564MLCDFC#11RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b, 21x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
11
R5F564MLCDFC#31R5F564MLCDFC#31RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
276
R5F564MLCDFC#V1R5F564MLCDFC#V1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
312
R5F564MLCDFP#11N/AR5F564MLCDFP#11RenesasIC MCU 32BIT 4MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b, 14x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
428
R5F564MLCDFP#31R5F564MLCDFP#31RenesasIC MCU 32BIT 4MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
38
R5F564MLCDFP#V1R5F564MLCDFP#V1RenesasIC MCU 32BIT 4MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
443
R5F564MLCDLC#21R5F564MLCDLC#21RenesasIC MCU 32BIT 4MB FLASH 177TFLGAMicrocontrollers177-TFLGA (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
177-TFLGA (8×8)
Package / Case:
177-TFLGA
484
R5F564MLCDLJ#21R5F564MLCDLJ#21RenesasIC MCU 32BIT 4MB FLASH 100TFLGAMicrocontrollers100-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (7×7)
Package / Case:
100-TFLGA
312
R5F564MLCDLK#21R5F564MLCDLK#21RenesasIC MCU 32BIT 4MB FLASH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
367
R5F564MLCGFB#V1R5F564MLCGFB#V1RenesasRX64M MCU 4MB LFQFP144 -40/105CMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
47
R5F564MLCGFC#V1R5F564MLCGFC#V1RenesasIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
786
R5F564MLCGFP#V1R5F564MLCGFP#V1RenesasIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
812
R5F564MLDDBG#21R5F564MLDDBG#21RenesasIC MCU 32BIT 4MB FLASH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
314
R5F564MLDDFB#11R5F564MLDDFB#11RenesasIC MCU 32BIT 4MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b, 21x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
580
R5F564MLDDFB#31R5F564MLDDFB#31RenesasIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
191
R5F564MLDDFB#V1R5F564MLDDFB#V1RenesasIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
926
R5F564MLDDFC#11R5F564MLDDFC#11RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b, 21x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,332
R5F564MLDDFC#31R5F564MLDDFC#31RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,116
R5F564MLDDFC#V1R5F564MLDDFC#V1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
552K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
767
R5F564MLDDFP#11N/AR5F564MLDDFP#11RenesasIC MCU 32BIT 4MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b, 14x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,066

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