Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R5F572NDHGFP#10R5F572NDHGFP#10RenesasIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,530
R5F572NDHGFP#30R5F572NDHGFP#30RenesasIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
522
R5F572NDHGLK#20R5F572NDHGLK#20RenesasIC MCU 32BIT 2MB FLASH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
762
R5F572NNDDBD#20R5F572NNDDBD#20RenesasIC MCU 32BIT 4MB FLASH 224LFBGAMicrocontrollers224-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
182
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
224-LFBGA (13×13)
Package / Case:
224-LFBGA
178
R5F572NNDDBG#20R5F572NNDDBG#20RenesasIC MCU 32BIT 4MB FLASH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
1,603
R5F572NNDDFB#10N/AR5F572NNDDFB#10RenesasIC MCU 32BIT 4MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
583
R5F572NNDDFB#30R5F572NNDDFB#30RenesasIC MCU 32BIT 4MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b, 21x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,379
R5F572NNDDFC#30R5F572NNDDFC#30RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b, 21x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
318
R5F572NNDDFP#10N/AR5F572NNDDFP#10RenesasIC MCU 32BIT 4MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
730
R5F572NNDDFP#30R5F572NNDDFP#30RenesasIC MCU 32BIT 4MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b, 14x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,497
R5F572NNDDLK#20R5F572NNDDLK#20RenesasIC MCU 32BIT 4MB FLASH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
1,309
R5F572NNDGBD#20R5F572NNDGBD#20RenesasIC MCU 32BIT 4MB FLASH 224LFBGAMicrocontrollers224-LFBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
182
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
224-LFBGA (13×13)
Package / Case:
224-LFBGA
94
R5F572NNDGBG#20R5F572NNDGBG#20RenesasIC MCU 32BIT 4MB FLASH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
934
R5F572NNDGFB#10R5F572NNDGFB#10RenesasIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
97
R5F572NNDGFB#30R5F572NNDGFB#30RenesasIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
288
R5F572NNDGFC#V0R5F572NNDGFC#V0RenesasIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,297
R5F572NNDGFP#10R5F572NNDGFP#10RenesasIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,239
R5F572NNDGFP#30R5F572NNDGFP#30RenesasIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,730
R5F572NNDGLK#20R5F572NNDGLK#20RenesasIC MCU 32BIT 4MB FLASH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
185
R5F572NNHDBD#20R5F572NNHDBD#20RenesasIC MCU 32BIT 4MB FLASH 224LFBGAMicrocontrollers224-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
182
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
224-LFBGA (13×13)
Package / Case:
224-LFBGA
1,405

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