Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R5F61665N50FPVR5F61665N50FPVRenesasIC MCU 32BIT 512KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
42
R5F61665N50LGVR5F61665N50LGVRenesasIC MCU 32BIT 512KB FLSH 145TFLGAMicrocontrollers145-TFLGA (9x9)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (9×9)
Package / Case:
145-TFLGA
1,079
R5F61668MZN50FPVN/AR5F61668MZN50FPVRenesasIC MCU 32BIT 1MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,631
R5F61668RD50BGVR5F61668RD50BGVRenesasIC MCU 32BIT 1MB FLASH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
389
R5F61668RD50FPVR5F61668RD50FPVRenesasIC MCU 32BIT 1MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,238
R5F61668RN50FPVR5F61668RN50FPVRenesasIC MCU 32BIT 1MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
615
R5F61668RZN50FPVN/AR5F61668RZN50FPVRenesasIC MCU 32BIT 1MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,042
N/AR5F61725J64FPVRenesasIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollersN/AN/AN/A

N/A

1,228
R5F64110DFB#U0R5F64110DFB#U0RenesasIC MCU 16/32BIT 256KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
63K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
87
R5F64111DFB#U0R5F64111DFB#U0RenesasIC MCU 16/32BIT 384KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
63K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,080
R5F64111NLG#U0R5F64111NLG#U0RenesasIC MCU 16/32BIT 384KB 100TFLGAMicrocontrollers100-TFLGA (5.5x5.5)N/A-20°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
63K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (5.5×5.5)
Package / Case:
100-TFLGA
731
R5F64112DFBR5F64112DFBRenesasIC MCU 16/32BIT 512KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
63K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,378
R5F64112DFB#U0R5F64112DFB#U0RenesasIC MCU 16/32BIT 512KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
63K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
488
R5F64112NLG#U0R5F64112NLG#U0RenesasIC MCU 16/32BIT 512KB 100TFLGAMicrocontrollers100-TFLGA (5.5x5.5)N/A-20°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
63K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (5.5×5.5)
Package / Case:
100-TFLGA
46
R5F64114DFBR5F64114DFBRenesasIC MCU LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,145
R5F64114DFB#U0R5F64114DFB#U0RenesasIC MCU 16/32BIT 256KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
961
R5F64114DFB#UAR5F64114DFB#UARenesasIC MCU 16/32BIT 256KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
121
R5F64115DFB#U0R5F64115DFB#U0RenesasIC MCU 16/32BIT 384KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,061
R5F64116DFB#U0R5F64116DFB#U0RenesasIC MCU 16/32BIT 512KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
82
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,027
R5F6411EDFN#UAR5F6411EDFN#UARenesasIC MCU 16/32B 128KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
R32C/100
Core Size:
16/32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IEBus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
49
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
827

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