Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7F701380EAFP-C#BA2R7F701380EAFP-C#BA2RenesasIC MCU 32BIT 2MB FLASH 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 150°C
Core Processor:
G3M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, SCI, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
86
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,419
R7F701380EAFP-C#KA2R7F701380EAFP-C#KA2Renesas32BIT MCU RH850/P1M-E 144LQFP T&Microcontrollers144-LFQFP (20x20)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, SCI, SENT, UART/USART
Peripherals:
DMA, POR, PWM, Temp Sensor, WDT
Number of I/O:
86
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,241
R7F701381EAFP-C#AA2N/AR7F701381EAFP-C#AA2RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 150°C
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
724
R7F701381EAFP-C#BA2R7F701381EAFP-C#BA2RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 150°C
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
352
R7F701381EAFP-C#KA2N/AR7F701381EAFP-C#KA2RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 150°C
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,386
R7F701381EAFP#AA2N/AR7F701381EAFP#AA2RenesasIC MCU 32BIT LFQFPMicrocontrollersN/AN/AN/A

N/A

609
R7F701381EAFP#BA2N/AR7F701381EAFP#BA2RenesasIC MCU 32BIT LFQFPMicrocontrollersN/AN/AN/A

N/A

228
R7F701381EAFP#KA2N/AR7F701381EAFP#KA2RenesasIC MCU 32BIT LFQFPMicrocontrollersN/AN/AN/A

N/A

241
R7F701382EAFP-C#AA2N/AR7F701382EAFP-C#AA2RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 150°C
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,322
R7F701382EAFP-C#BA2R7F701382EAFP-C#BA2RenesasIC MCU 32BIT 1MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 150°C
Core Processor:
G3M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
71
R7F701382EAFP-C#KA2N/AR7F701382EAFP-C#KA2RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 150°C
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
629
R7F701382EAFP#AA2N/AR7F701382EAFP#AA2RenesasIC MCU 32BIT LFQFPMicrocontrollersN/AN/AN/A

N/A

287
R7F701382EAFP#KA2N/AR7F701382EAFP#KA2RenesasIC MCU 32BIT LFQFPMicrocontrollersN/AN/AN/A

N/A

327
R7F701383EAFP-C#BA2R7F701383EAFP-C#BA2RenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LFQFP (16x16)N/A-40°C ~ 150°C
Core Processor:
G3M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, SCI, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
86
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (16×16)
Package / Case:
144-LQFP
783
R7F701383EAFP-C#KA2R7F701383EAFP-C#KA2Renesas32BIT MCU RH850/P1M-E 1M 144LQFPMicrocontrollers144-LFQFP (16x16)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, SCI, SENT, UART/USART
Peripherals:
DMA, POR, PWM, Temp Sensor, WDT
Number of I/O:
86
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (16×16)
Package / Case:
144-LQFP
514
R7F701384EAFP-C#BA2R7F701384EAFP-C#BA2RenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LFQFP (16x16)N/A-40°C ~ 150°C
Core Processor:
G3M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, SCI, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
86
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (16×16)
Package / Case:
144-LQFP
1,098
R7F701384EAFP-C#KA2R7F701384EAFP-C#KA2Renesas32BIT MCU RH850/P1M-E 1M 144LQFPMicrocontrollers144-LFQFP (16x16)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, SCI, SENT, UART/USART
Peripherals:
DMA, POR, PWM, Temp Sensor, WDT
Number of I/O:
86
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (16×16)
Package / Case:
144-LQFP
248
R7F701385EAFP-C#BA2R7F701385EAFP-C#BA2RenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 150°C
Core Processor:
G3M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, SCI, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
86
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
95
R7F701385EAFP-C#KA2R7F701385EAFP-C#KA2Renesas32BIT MCU RH850/P1M-E 1M 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, SCI, SENT, UART/USART
Peripherals:
DMA, POR, PWM, Temp Sensor, WDT
Number of I/O:
86
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,083
R7F701386EAFP-C#BA2R7F701386EAFP-C#BA2RenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 150°C
Core Processor:
G3M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, SCI, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
86
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
856

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