Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
S9S12GN32BCLCR
S9S12GN32BCLCRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
414
S9S12GN32BMLCN/AS9S12GN32BMLCNXP SemiconductorsIC MCU 16BIT 32KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
485
S9S12GN32BMLCR
S9S12GN32BMLCRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
935
S9S12GN32BMTJ
S9S12GN32BMTJNXP SemiconductorsIC MCU 16BIT 32KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
14
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
73
S9S12GN32BVLC
S9S12GN32BVLCNXP SemiconductorsIC MCU 16BIT 32KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
93
S9S12GN32BVLCR
S9S12GN32BVLCRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,868
S9S12GN32BVTJ
S9S12GN32BVTJNXP SemiconductorsIC MCU 16BIT 32KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
14
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
180
S9S12GN32BVTJR
S9S12GN32BVTJRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
14
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
618
S9S12GN32F0CFT
S9S12GN32F0CFTNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
1,440
S9S12GN32F0CFTR
S9S12GN32F0CFTRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
764
S9S12GN32F0CLF
S9S12GN32F0CLFNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,211
S9S12GN32F0CLFR
S9S12GN32F0CLFRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,414
S9S12GN32F0MFT
S9S12GN32F0MFTNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
108
S9S12GN32F0MLF
S9S12GN32F0MLFNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
702
S9S12GN32F0MLFR
S9S12GN32F0MLFRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
217
S9S12GN32F0VFTN/AS9S12GN32F0VFTNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
73
S9S12GN32F0VFTRN/AS9S12GN32F0VFTRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
1,933
S9S12GN32F0VLF
S9S12GN32F0VLFNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
511
S9S12GN32F0VLFRN/AS9S12GN32F0VLFRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
93
S9S12GN32F0WLFN/AS9S12GN32F0WLFNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 150°C (TA)
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
17

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