Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
S9S12P128J0CLHRN/AS9S12P128J0CLHRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,265
S9S12P128J0CQKN/AS9S12P128J0CQKNXP SemiconductorsIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,587
S9S12P128J0MFTS9S12P128J0MFTNXP SemiconductorsIC MCU 16BIT 128KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
68
S9S12P128J0MFTRN/AS9S12P128J0MFTRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
1,747
S9S12P128J0MLHS9S12P128J0MLHNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
930
S9S12P128J0MLHRN/AS9S12P128J0MLHRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,613
S9S12P128J0MQKS9S12P128J0MQKNXP SemiconductorsIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,275
S9S12P128J0VFTN/AS9S12P128J0VFTNXP SemiconductorsIC MCU 16BIT 128KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
323
S9S12P128J0VFTRS9S12P128J0VFTRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
142
S9S12P128J0VLHN/AS9S12P128J0VLHNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
915
S9S12P128J0VLHRN/AS9S12P128J0VLHRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
60
S9S12P32J0CFTN/AS9S12P32J0CFTNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
355
S9S12P32J0CFTRN/AS9S12P32J0CFTRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
212
S9S12P32J0MFTS9S12P32J0MFTNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
548
S9S12P32J0MLHS9S12P32J0MLHNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
496
S9S12P32J0MLHRS9S12P32J0MLHRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,507
S9S12P32J0MQKS9S12P32J0MQKNXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
973
S9S12P32J0VFTS9S12P32J0VFTNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
557
S9S12P32J0VFTRS9S12P32J0VFTRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
957
S9S12P32J0VLHN/AS9S12P32J0VLHNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
61

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