Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SM320F28335KGDS1SM320F28335KGDS1Texas InstrumentsIC MCU 32BIT 512KB FLASH 0XCEPTMicrocontrollers0-XCEPTN/A-55°C ~ 210°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 210°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
0-XCEPT
Package / Case:
Die
1,287
SM320F28335PTPMEPSM320F28335PTPMEPTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-55°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
154
SM320F28335PTPSSM320F28335PTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-55°C ~ 150°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,891
SM320LF2407APGEMEPSM320LF2407APGEMEPTexas InstrumentsIC MCU 16BIT 64KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-55°C ~ 125°C (TA)
Core Processor:
C2xx DSP
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
5K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
950
SM470R1B1MHFQSSM470R1B1MHFQSTexas InstrumentsIC MCU 16/32BIT 1MB FLASH 84CFPMicrocontrollers84-CFPN/A-55°C ~ 220°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
60MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 2.05V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 220°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
84-CFP
Package / Case:
84-CBFQFP Exposed Pad and Tie Bar
1,355
SM470R1B1MHKPSSM470R1B1MHKPSTexas InstrumentsIC MCU 16/32BIT 1MB FLASH 84CFPMicrocontrollers84-CFP (13.8x13.8)N/A-55°C ~ 220°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
60MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 2.05V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 220°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
84-CFP (13.8×13.8)
Package / Case:
84-BFCQFP Exposed Pad
1,104
SM470R1B1MKGDS1SM470R1B1MKGDS1Texas InstrumentsIC MCU 16/32BIT 1MB FLASH 0XCEPTMicrocontrollers0-XCEPTN/A-55°C ~ 220°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
60MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 2.05V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 220°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
0-XCEPT
Package / Case:
Die
271
SM470R1B1MPGESSM470R1B1MPGESTexas InstrumentsIC MCU 16/32BIT 1MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-55°C ~ 150°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
60MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 2.05V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
95
SM912F634DV2AESM912F634DV2AENXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-HLQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
S12
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
3
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HLQFP (7×7)
Package / Case:
48-LQFP Exposed Pad
1,195
SM912F634DV2AER2SM912F634DV2AER2NXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-HLQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
S12
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
3
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HLQFP (7×7)
Package / Case:
48-LQFP Exposed Pad
321
N/AN/ASMC603SP2onsemiOFFLINE QR PWM CONTROLLERControllersN/A-–

N/A

185
SMOMAPL138BGWTA3RSMOMAPL138BGWTA3RTexas InstrumentsIC MPU OMAP-L1X 375MHZ 361NFBGAMicroprocessors361-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (16×16)
Grade:
Industrial
933
SN0806723IPNRSN0806723IPNRTexas InstrumentsIC MCU 16BIT 64KB FLASH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 5x10b, 2x24b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
408
N/AN/ASN1002018DAPRTexas InstrumentsIC MCU 16BITMicrocontrollersN/AN/A–

N/A

315
N/AN/ASN104629DWRTexas InstrumentsANALOG INTERFACEControllersN/AN/AN/A

N/A

1,508
N/ASN2005111512ZVFTexas InstrumentsIC CARDBUS CONTROLLER 216-BGAControllers216-NFBGA (16x16)3.3V–
Protocol:
PCI CardBus
Function:
Controller
Interface:
PCI
Voltage – Supply:
3.3V
Package / Case:
216-LFBGA
Supplier Device Package:
216-NFBGA (16×16)
1,279
SN278792960N/ASN278792960Texas InstrumentsIC MPU SITARA 600MHZ 324NFBGAMicroprocessors324-NFBGA (15x15)N/A0°C ~ 90°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-NFBGA (15×15)
Grade:
Commercial
830
SN3257QDYYRQ1SN3257QDYYRQ1Texas InstrumentsIC SWITCH SPDT X 1 5OHM 16SOT23Analog Switches, Multiplexers, Demultiplexers16-SOT-23-THINN/A-40°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
5Ohm
Channel-to-Channel Matching (ΔRon):
70mOhm
Voltage – Supply, Single (V+):
1.5V ~ 5.5V
Switch Time (Ton, Toff) (Max):
35µs, 95ns
-3db Bandwidth:
1.2GHz
Charge Injection:
3.5pC
Channel Capacitance (CS(off), CD(off)):
4pF, 4pF
Current – Leakage (IS(off)) (Max):
900nA (Typ)
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
SOT-23-16 Thin, SOT-23 Variant
Supplier Device Package:
16-SOT-23-THIN
877
SN3257QPWRQ1SN3257QPWRQ1Texas InstrumentsIC SWITCH SPDT X 1 5OHM 16TSSOPAnalog Switches, Multiplexers, Demultiplexers16-TSSOPN/A-40°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
5Ohm
Channel-to-Channel Matching (ΔRon):
70mOhm
Voltage – Supply, Single (V+):
1.5V ~ 5.5V
Switch Time (Ton, Toff) (Max):
35µs, 95ns
-3db Bandwidth:
1.2GHz
Charge Injection:
3.5pC
Channel Capacitance (CS(off), CD(off)):
4pF, 4pF
Current – Leakage (IS(off)) (Max):
900nA (Typ)
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
Supplier Device Package:
16-TSSOP
492
SN55107AJSN55107AJTexas InstrumentsIC RECEIVER 0/2 14CDIPDrivers, Receivers, Transceivers14-CDIP±4.5V ~ 5.5V-55°C ~ 125°C (TA)
Type:
Receiver
Number of Drivers/Receivers:
0/2
Voltage – Supply:
±4.5V ~ 5.5V
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Through Hole
Package / Case:
14-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
14-CDIP
115

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