Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
ADUC7021BCPZ62ADUC7021BCPZ62Analog Devices Inc.IC MCU 16/32B 62KB FLASH 40LFCSPMicrocontrollers40-LFCSP-VQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
13
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-VQ (6×6)
Package / Case:
40-VFQFN Exposed Pad, CSP
424
ADUC7021BCPZ62-RLADUC7021BCPZ62-RLAnalog Devices Inc.IC MCU 16/32B 62KB FLASH 40LFCSPMicrocontrollers40-LFCSP-VQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
13
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-VQ (6×6)
Package / Case:
40-VFQFN Exposed Pad, CSP
323
ADUC7021BCPZ62-RL7ADUC7021BCPZ62-RL7Analog Devices Inc.IC MCU 16/32B 62KB FLASH 40LFCSPMicrocontrollers40-LFCSP-VQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
13
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-VQ (6×6)
Package / Case:
40-VFQFN Exposed Pad, CSP
1,626
ADUC7021BCPZ62IADUC7021BCPZ62IAnalog Devices Inc.IC MCU 16/32B 62KB FLASH 40LFCSPMicrocontrollers40-LFCSP-VQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
13
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-VQ (6×6)
Package / Case:
40-VFQFN Exposed Pad, CSP
1,964
ADUC7021BCPZ62I-RLADUC7021BCPZ62I-RLAnalog Devices Inc.IC MCU 16/32B 62KB FLASH 40LFCSPMicrocontrollers40-LFCSP-VQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
13
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-VQ (6×6)
Package / Case:
40-VFQFN Exposed Pad, CSP
109
ADUC7022BCPZ32ADUC7022BCPZ32Analog Devices Inc.IC MCU 16/32B 32KB FLASH 40LFCSPMicrocontrollers40-LFCSP-VQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
13
Program Memory Size:
32KB (16K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-VQ (6×6)
Package / Case:
40-VFQFN Exposed Pad, CSP
1,468
ADUC7022BCPZ32-RLADUC7022BCPZ32-RLAnalog Devices Inc.IC MCU 16/32B 32KB FLASH 40LFCSPMicrocontrollers40-LFCSP-VQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
13
Program Memory Size:
32KB (16K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-VQ (6×6)
Package / Case:
40-VFQFN Exposed Pad, CSP
1,068
ADUC7022BCPZ62ADUC7022BCPZ62Analog Devices Inc.IC MCU 16/32B 62KB FLASH 40LFCSPMicrocontrollers40-LFCSP-VQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
13
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-VQ (6×6)
Package / Case:
40-VFQFN Exposed Pad, CSP
950
ADUC7022BCPZ62-RL7ADUC7022BCPZ62-RL7Analog Devices Inc.IC MCU 16/32B 62KB FLASH 40LFCSPMicrocontrollers40-LFCSP-VQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
13
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-VQ (6×6)
Package / Case:
40-VFQFN Exposed Pad, CSP
1,419
ADUC7023BCBZ62I-R7ADUC7023BCBZ62I-R7Analog Devices Inc.IC MCU 16/32B 62KB FLASH 36WLCSPMicrocontrollers36-WLCSP (3.4x3.4)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
I2C, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-WLCSP (3.4×3.4)
Package / Case:
36-UFBGA, WLCSP
543
ADUC7023BCP6Z62IADUC7023BCP6Z62IAnalog Devices Inc.IC MCU 16/32B 62KB FLASH 40LFCSPMicrocontrollers40-LFCSP-WQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
I2C, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-WQ (6×6)
Package / Case:
40-WFQFN Exposed Pad, CSP
38
ADUC7023BCP6Z62IR7ADUC7023BCP6Z62IR7Analog Devices Inc.IC MCU 16/32B 62KB FLASH 40LFCSPMicrocontrollers40-LFCSP-WQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
I2C, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-WQ (6×6)
Package / Case:
40-WFQFN Exposed Pad, CSP
1,169
ADUC7023BCP6Z62IRLADUC7023BCP6Z62IRLAnalog Devices Inc.IC MCU 16/32B 62KB FLASH 40LFCSPMicrocontrollers40-LFCSP-WQ (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
I2C, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12 x12b; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-LFCSP-WQ (6×6)
Package / Case:
40-WFQFN Exposed Pad, CSP
1,532
ADUC7023BCPZ62IADUC7023BCPZ62IAnalog Devices Inc.IC MCU 16/32B 62KB FLASH 32LFCSPMicrocontrollers32-LFCSP (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
I2C, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LFCSP (5×5)
Package / Case:
32-WFQFN Exposed Pad, CSP
1,418
ADUC7023BCPZ62I-R7ADUC7023BCPZ62I-R7Analog Devices Inc.IC MCU 16/32B 62KB FLASH 32LFCSPMicrocontrollers32-LFCSP (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
I2C, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LFCSP (5×5)
Package / Case:
32-WFQFN Exposed Pad, CSP
865
ADUC7023BCPZ62I-RLADUC7023BCPZ62I-RLAnalog Devices Inc.IC MCU 16/32B 62KB FLASH 32LFCSPMicrocontrollers32-LFCSP (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
I2C, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LFCSP (5×5)
Package / Case:
32-WFQFN Exposed Pad, CSP
1,378
ADUC7024BCPZ62ADUC7024BCPZ62Analog Devices Inc.IC MCU 16/32B 62KB FLASH 64LFCSPMicrocontrollers64-LFCSP-VQ (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
30
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP-VQ (9×9)
Package / Case:
64-VFQFN Exposed Pad, CSP
1,216
ADUC7024BCPZ62-RL7ADUC7024BCPZ62-RL7Analog Devices Inc.IC MCU 16/32B 62KB FLASH 64LFCSPMicrocontrollers64-LFCSP-VQ (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
30
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP-VQ (9×9)
Package / Case:
64-VFQFN Exposed Pad, CSP
989
ADUC7024BCPZ62IADUC7024BCPZ62IAnalog Devices Inc.IC MCU 16/32B 62KB FLASH 64LFCSPMicrocontrollers64-LFCSP-VQ (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
30
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP-VQ (9×9)
Package / Case:
64-VFQFN Exposed Pad, CSP
950
ADUC7024BCPZ62I-RLADUC7024BCPZ62I-RLAnalog Devices Inc.IC MCU 16/32B 62KB FLASH 64LFCSPMicrocontrollers64-LFCSP-VQ (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
44MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, PWM, PSM, Temp Sensor, WDT
Number of I/O:
30
Program Memory Size:
62KB (31K x16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP-VQ (9×9)
Package / Case:
64-VFQFN Exposed Pad, CSP
140

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