Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/ASPC58EC80E7E0C0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
332
N/AN/ASPC58EC80E7E0C1XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
300
SPC58EC80E7FMC0XSPC58EC80E7FMC0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z420
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA
Number of I/O:
64
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,546
N/AN/ASPC58EC80E7FMC1XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
629
SPC58EC80E7G0C0XSPC58EC80E7G0C0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z420
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA
Number of I/O:
64
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
454
N/AN/ASPC58EC80E7G0C1XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
976
N/AN/ASPC58EC80E7GMC0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
807
N/ASPC58EC80E7GMC1XSTMicroelectronicsLinear IC'sMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
705
SPC58EC80E7QMC0XSPC58EC80E7QMC0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z420
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA
Number of I/O:
64
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,448
SPC58EC80E7QMC0YSPC58EC80E7QMC0YSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176QFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C
Core Processor:
e200z420
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA
Number of I/O:
64
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
398
N/ASPC58EC80E7QMC1XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)3V - 5.5V-40°C – 125°C
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Program Memory Size:
4MB (4M x 8)
Mounting Type:
Surface Mount
813
N/AN/ASPC58EC80E7QMC1YSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
546
SPC58EE80E7QMHAYSPC58EE80E7QMHAYSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176QFPMicrocontrollers176-eLQFP (24x24)1.2V, 3.3V, 5V-40°C – 125°C
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Program Memory Size:
4MB (4M x 8)
Mounting Type:
Surface Mount
734
N/AN/ASPC58EE80E7QMSAYSTMicroelectronicsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, MDIO, PSI5, SENT, SPI, UART/USART
Peripherals:
DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
288K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10b SAR, 12/16b Sigma-Delta
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
523
SPC58EE84E7QMSARSPC58EE84E7QMSARSTMicroelectronicsIC MCU 32BIT 6MB FLASH 176QFPMicrocontrollers176-eLQFP (24x24)1.2V, 3.3V, 5V-40°C – 125°C
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Program Memory Size:
6MB (6M x 8)
Mounting Type:
Surface Mount
1,722
SPC58EG80E5FEC0XSPC58EG80E5FEC0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 144ETQFPMicrocontrollers144-eTQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA
Number of I/O:
64
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
1.2V, 3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-eTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,345
N/AN/ASPC58EG80E5GEC0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 144TQFPMicrocontrollers144-TQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
210
SPC58EG80E5P0H0YSPC58EG80E5P0H0YSTMicroelectronicsIC MCU 32BIT 4MB FLASH 144ETQFPMicrocontrollers144-eTQFP (20x20)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, WDT
Number of I/O:
64
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-eTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
8
SPC58EG80E5PEC0XSPC58EG80E5PEC0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 144ETQFPMicrocontrollers144-eTQFP (20x20)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, WDT
Number of I/O:
64
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-eTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,264
N/ASPC58EG80E5QEC0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 144ETQFPMicrocontrollers144-eTQFP (20x20)1.14V - 1.26V-40°C – 150°C
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Program Memory Size:
4MB (4M x 8)
Mounting Type:
Surface Mount
576

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