Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
ST7FLITE05Y0M6ST7FLITE05Y0M6STMicroelectronicsIC MCU 8BIT 1.5KB FLASH 16SOMicrocontrollers16-SON/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 5x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SO
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
1,103
ST7FLITE09F0U6ST7FLITE09F0U6STMicroelectronicsIC MCU 8BIT 1.5KB FLASH 20QFNMicrocontrollers20-QFN (6x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 5x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (6×5)
Package / Case:
20-VQFN Exposed Pad
19
ST7FLITE09M6TRST7FLITE09M6TRSTMicroelectronicsIC MCU 8BIT 1.5KB FLASH 16SOMicrocontrollers16-SON/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 5x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SO
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
1,538
ST7FLITE09Y0B6ST7FLITE09Y0B6STMicroelectronicsIC MCU 8BIT 1.5KB FLASH 16DIPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 5x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
402
ST7FLITE09Y0M6ST7FLITE09Y0M6STMicroelectronicsIC MCU 8BIT 1.5KB FLASH 16SOMicrocontrollers16-SON/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 5x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SO
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
446
N/AN/AST7FLITE0HY0M6STMicroelectronicsIC MCU 8 BIT FLASHMicrocontrollers-N/A

N/A

258
ST7FLITE10F1M6ST7FLITE10F1M6STMicroelectronicsIC MCU 8BIT 4KB FLASH 20SOICMicrocontrollers20-SON/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SO
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
1,526
ST7FLITE15F1B6ST7FLITE15F1B6STMicroelectronicsIC MCU 8BIT 4KB FLASH 20SOICMicrocontrollers20-SON/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SO
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
293
ST7FLITE15F1M6ST7FLITE15F1M6STMicroelectronicsIC MCU 8BIT 4KB FLASH 20SOICMicrocontrollers20-SON/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SO
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
823
ST7FLITE15M6TRST7FLITE15M6TRSTMicroelectronicsIC MCU 8BIT 4KB FLASH 20SOICMicrocontrollers20-SON/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SO
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
1,290
ST7FLITE19F1B6ST7FLITE19F1B6STMicroelectronicsIC MCU 8BIT 4KB FLASH 20DIPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
20-DIP (0.300″”, 7.62mm)
963
ST7FLITE19F1M6ST7FLITE19F1M6STMicroelectronicsIC MCU 8BIT 4KB FLASH 20SOICMicrocontrollers20-SON/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SO
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
558
ST7FLITE20F1B6ST7FLITE20F1B6STMicroelectronicsIC MCU 8BIT 8KB FLASH 20DIPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
384 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
20-DIP (0.300″”, 7.62mm)
1,047
ST7FLITE20F2B6ST7FLITE20F2B6STMicroelectronicsIC MCU 8BIT 8KB FLASH 20DIPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
384 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
20-DIP (0.300″”, 7.62mm)
505
ST7FLITE25F1B6ST7FLITE25F1B6STMicroelectronicsIC MCU 8BIT 8KB FLASH 20DIPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
384 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
20-DIP (0.300″”, 7.62mm)
606
ST7FLITE25F2B6ST7FLITE25F2B6STMicroelectronicsIC MCU 8BIT 8KB FLASH 20DIPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
384 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
20-DIP (0.300″”, 7.62mm)
1,354
ST7FLITE25F2M6ST7FLITE25F2M6STMicroelectronicsIC MCU 8BIT 8KB FLASH 20SOMicrocontrollers20-SON/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
384 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SO
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
237
ST7FLITE25M6TRST7FLITE25M6TRSTMicroelectronicsIC MCU 8BIT 8KB FLASH 20SOMicrocontrollers20-SO2.4V - 5.5V-40°C – 85°C
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Program Memory Size:
8KB (8K x 8)
Mounting Type:
Surface Mount
592
ST7FLITE29F1B6ST7FLITE29F1B6STMicroelectronicsIC MCU 8BIT 8KB FLASH 20DIPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
384 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
20-DIP (0.300″”, 7.62mm)
1,187
ST7FLITE29F2B6ST7FLITE29F2B6STMicroelectronicsIC MCU 8BIT 8KB FLASH 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
384 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 5.5V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
771

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