Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AM2431BSDFHIALVRAM2431BSDFHIALVRTexas InstrumentsIC MCU 32BIT 128KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
198
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
601
AM2431BSDFHIALXRAM2431BSDFHIALXRTexas InstrumentsIC MCU 32BIT 128KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
148
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
837
AM2431BSDGHIALVRAM2431BSDGHIALVRTexas InstrumentsIC MCU 32BIT 128KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
198
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
196
AM2431BSDGHIALXRAM2431BSDGHIALXRTexas InstrumentsIC MCU 32BIT 128KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
148
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
740
AM2432BKEGHIALXRAM2432BKEGHIALXRTexas InstrumentsIC MCU 32BIT 256KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
469
AM2432BKFGHIALXRAM2432BKFGHIALXRTexas InstrumentsIC MCU 32BIT 256KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
1,222
AM2432BSDFHIALVRAM2432BSDFHIALVRTexas InstrumentsIC MCU 32BIT 256KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
198
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
206
AM2432BSDFHIALXRAM2432BSDFHIALXRTexas InstrumentsIC MCU 32BIT 256KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
577
AM2432BSDGHIALVAM2432BSDGHIALVTexas InstrumentsIC MCU 32BIT 256KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Quad-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
198
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
549
AM2432BSDGHIALVRAM2432BSDGHIALVRTexas InstrumentsIC MCU 32BIT 256KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
198
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
163
AM2432BSDGHIALXRAM2432BSDGHIALXRTexas InstrumentsIC MCU 32BIT 256KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
28
AM2432BSEFHIALVRAM2432BSEFHIALVRTexas InstrumentsIC MCU 32BIT 256KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
198
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
321
AM2432BSEFHIALXRAM2432BSEFHIALXRTexas InstrumentsIC MCU 32BIT 256KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
1,305
AM2432BSFFHIALVAM2432BSFFHIALVTexas InstrumentsIC MCU 32BIT 256KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Quad-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
198
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
729
AM2432BSFFHIALVRAM2432BSFFHIALVRTexas InstrumentsIC MCU 32BIT 256KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Quad-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
198
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
964
AM2432BSFFHIALXRAM2432BSFFHIALXRTexas InstrumentsIC MCU 32BIT 256KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
587
AM2434BSDFHIALVRAM2434BSDFHIALVRTexas InstrumentsQUAD-CORE ARM CORTEX-R5F-BASED MMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit 5-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
198
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
778
AM2434BSDFHIALXRAM2434BSDFHIALXRTexas InstrumentsQUAD-CORE ARM CORTEX-R5F-BASED MMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit 5-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
897
AM2434BSDGHIALVRAM2434BSDGHIALVRTexas InstrumentsQUAD-CORE ARM CORTEX-R5F-BASED MMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit 5-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
198
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
1,125
AM2434BSDGHIALXRAM2434BSDGHIALXRTexas InstrumentsQUAD-CORE ARM CORTEX-R5F-BASED MMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit 5-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
273

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