Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
THGBMHG8C2LBAILTHGBMHG8C2LBAILKioxia America, Inc.IC FLASH 256GBIT EMMC 153WFBGAMemory153-WFBGA (11.5x13)2.7V ~ 3.6V-25°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
52 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
32G x 8
Memory Size:
256 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
537
THGBMHG8C4LBAU7THGBMHG8C4LBAU7Kioxia America, Inc.IC FLASH 256GBIT EMMC 153WFBGAMemory153-WFBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 105°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Automotive
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
32G x 8
Memory Size:
256 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
731
THGBMHG8C4LBAWRN/ATHGBMHG8C4LBAWRKioxia America, Inc.IC FLASH 256GBIT EMMC 153WFBGAMemory153-WFBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
52 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
32G x 8
Memory Size:
256 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
1,367
THGBMHG9C4LBAIRTHGBMHG9C4LBAIRKioxia America, Inc.IC FLASH 512GBIT EMMC 153WFBGAMemory153-WFBGA (11.5x13)2.7V ~ 3.6V-25°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
52 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
64G x 8
Memory Size:
512 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
1,386
THGBMHG9C8LBAU8THGBMHG9C8LBAU8Kioxia America, Inc.IC FLASH 512GBIT EMMC 153WFBGAMemory153-WFBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 105°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Automotive
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
64G x 8
Memory Size:
512 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
884
THGBMHG9C8LBAWGN/ATHGBMHG9C8LBAWGKioxia America, Inc.IC FLASH 512GBIT EMMC 153WFBGAMemory153-WFBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
52 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
64G x 8
Memory Size:
512 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
1,679
THGBMJG6C1LBAILN/ATHGBMJG6C1LBAILKioxia America, Inc.IC FLASH 64GBIT EMMC 153FBGAMemory153-WFBGA (11.5x13)N/A-25°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
N/A
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
8G x 8
Memory Size:
64 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
1,505
THGBMJG6C1LBAU7N/ATHGBMJG6C1LBAU7Kioxia America, Inc.IC FLASH 64GBIT EMMC 153FBGAMemory153-WFBGA (11.5x13)N/A-40°C ~ 105°C (TA)
Access Time:
N/A
Clock Frequency:
N/A
Grade:
Automotive
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
8G x 8
Memory Size:
64 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
285
THGBMJG8C2LBAILN/ATHGBMJG8C2LBAILKioxia America, Inc.IC FLASH 256GBIT EMMC 153FBGAMemory153-WFBGA (11.5x13)N/A-25°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
N/A
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
32G x 8
Memory Size:
256 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
347
THGBMJG8C4LBAU8THGBMJG8C4LBAU8Kioxia America, Inc.IC FLASH 256GBIT EMMC 153FBGAMemory153-WFBGA (11.5x13)N/A-40°C ~ 105°C (TA)
Access Time:
N/A
Clock Frequency:
N/A
Grade:
Automotive
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
32G x 8
Memory Size:
256 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
213
THGBMNG5D1LBAILN/ATHGBMNG5D1LBAILKioxia America, Inc.IC FLASH 32GBIT EMMC 153WFBGAMemory153-WFBGA (11.5x13)2.7V ~ 3.6V-25°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC
Memory Organization:
4G x 8
Memory Size:
32 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
1,207
THGBMUG8C2LBAILTHGBMUG8C2LBAILKioxia America, Inc.IC FLASH 256GBIT EMMC 153FBGAMemory153-BGA (11.5x13)2.7V ~ 3.6V-20°C ~ 85°C (TC)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
32G x 8
Memory Size:
256 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
336
THS6002CDWP
THS6002CDWPTexas InstrumentsIC TRANSCEIVER FULL 2/2 20HSOICDrivers, Receivers, Transceivers20-HSOIC9V ~ 32V, ±4.5V ~ 16V0°C ~ 70°C
Type:
Transceiver
Protocol:
DSL
Number of Drivers/Receivers:
2/2
Duplex:
Full
Voltage – Supply:
9V ~ 32V, ±4.5V ~ 16V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
20-SOIC (0.295″”, 7.50mm Width) Exposed Pad
Supplier Device Package:
20-HSOIC
423
THS6002CDWPG4
THS6002CDWPG4Texas InstrumentsIC TRANSCEIVER FULL 2/2 20HSOICDrivers, Receivers, Transceivers20-HSOIC9V ~ 32V, ±4.5V ~ 16V0°C ~ 70°C
Type:
Transceiver
Protocol:
DSL
Number of Drivers/Receivers:
2/2
Duplex:
Full
Voltage – Supply:
9V ~ 32V, ±4.5V ~ 16V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
20-SOIC (0.295″”, 7.50mm Width) Exposed Pad
Supplier Device Package:
20-HSOIC
987
THS6002CDWPR
THS6002CDWPRTexas InstrumentsIC TRANSCEIVER FULL 2/2 20HSOICDrivers, Receivers, Transceivers20-HSOIC9V ~ 32V, ±4.5V ~ 16V0°C ~ 70°C
Type:
Transceiver
Protocol:
DSL
Number of Drivers/Receivers:
2/2
Duplex:
Full
Voltage – Supply:
9V ~ 32V, ±4.5V ~ 16V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
20-SOIC (0.295″”, 7.50mm Width) Exposed Pad
Supplier Device Package:
20-HSOIC
1,325
THS6002IDWP
THS6002IDWPTexas InstrumentsIC TRANSCEIVER FULL 2/2 20HSOICDrivers, Receivers, Transceivers20-HSOIC9V ~ 32V, ±4.5V ~ 16V-40°C ~ 85°C
Type:
Transceiver
Protocol:
DSL
Number of Drivers/Receivers:
2/2
Duplex:
Full
Voltage – Supply:
9V ~ 32V, ±4.5V ~ 16V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
20-SOIC (0.295″”, 7.50mm Width) Exposed Pad
Supplier Device Package:
20-HSOIC
1,245
THS6002IDWPR
THS6002IDWPRTexas InstrumentsIC TRANSCEIVER FULL 2/2 20HSOICDrivers, Receivers, Transceivers20-HSOIC9V ~ 32V, ±4.5V ~ 16V-40°C ~ 85°C
Type:
Transceiver
Protocol:
DSL
Number of Drivers/Receivers:
2/2
Duplex:
Full
Voltage – Supply:
9V ~ 32V, ±4.5V ~ 16V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
20-SOIC (0.295″”, 7.50mm Width) Exposed Pad
Supplier Device Package:
20-HSOIC
900
THS6007IPWP
THS6007IPWPTexas InstrumentsIC TRANSCEIVER FULL 2/2 28HTSSOPDrivers, Receivers, Transceivers28-HTSSOP4.5V ~ 16V-40°C ~ 85°C
Type:
Transceiver
Number of Drivers/Receivers:
2/2
Duplex:
Full
Voltage – Supply:
4.5V ~ 16V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
28-PowerTSSOP (0.173″”, 4.40mm Width)
Supplier Device Package:
28-HTSSOP
248
THS6012CDWP
THS6012CDWPTexas InstrumentsIC DRIVER 2/0 20HSOICDrivers, Receivers, Transceivers20-HSOIC4.5V ~ 16V0°C ~ 70°C
Type:
Driver
Protocol:
DSL
Number of Drivers/Receivers:
2/0
Voltage – Supply:
4.5V ~ 16V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
20-SOIC (0.295″”, 7.50mm Width) Exposed Pad
Supplier Device Package:
20-HSOIC
520
THS6012CDWPR
THS6012CDWPRTexas InstrumentsIC DRIVER 2/0 20HSOICDrivers, Receivers, Transceivers20-HSOIC4.5V ~ 16V0°C ~ 70°C
Type:
Driver
Protocol:
DSL
Number of Drivers/Receivers:
2/0
Voltage – Supply:
4.5V ~ 16V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
20-SOIC (0.295″”, 7.50mm Width) Exposed Pad
Supplier Device Package:
20-HSOIC
547

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