Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
TMS320F2812ZHHARTMS320F2812ZHHARTexas InstrumentsIC MCU 32BIT 256KB FLASH 179BGAMicrocontrollers179-BGA MicroStar (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
256KB (128K x 16)
Program Memory Type:
FLASH
RAM Size:
18K x 16
Voltage – Supply (Vcc/Vdd):
1.81V ~ 2V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
179-BGA MicroStar (12×12)
Package / Case:
179-LFBGA
21
TMS320F2812ZHHSTMS320F2812ZHHSTexas InstrumentsIC MCU 32BIT 256KB FLASH 179BGAMicrocontrollers179-BGA MicroStar (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
256KB (128K x 16)
Program Memory Type:
FLASH
RAM Size:
18K x 16
Voltage – Supply (Vcc/Vdd):
1.81V ~ 2V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
179-BGA MicroStar (12×12)
Package / Case:
179-LFBGA
1,119
TMS320F28232PGFATMS320F28232PGFATexas InstrumentsIC MCU 32BIT 128KB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
26K x 16
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
879
TMS320F28232PTPQTMS320F28232PTPQTexas InstrumentsIC MCU 32BIT 128KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
26K x 16
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
565
TMS320F28232PTPSTMS320F28232PTPSTexas InstrumentsIC MCU 32BIT 128KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
26K x 16
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
531
TMS320F28232ZAYATMS320F28232ZAYATexas InstrumentsIC MCU 32BIT 128KB FLSH 179NFBGAMicrocontrollers179-NFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
26K x 16
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
179-NFBGA (12×12)
Package / Case:
179-LFBGA
1,127
TMS320F28232ZHHATMS320F28232ZHHATexas InstrumentsIC MCU 32BIT 128KB FLASH 179BGAMicrocontrollers179-BGA MicroStar (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
26K x 16
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
179-BGA MicroStar (12×12)
Package / Case:
179-LFBGA
328
TMS320F28232ZJZATMS320F28232ZJZATexas InstrumentsIC MCU 32BIT 128KB FLASH 176BGAMicrocontrollers176-BGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
26K x 16
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-BGA (15×15)
Package / Case:
176-BGA
468
TMS320F28232ZJZQTMS320F28232ZJZQTexas InstrumentsIC MCU 32BIT 128KB FLASH 176BGAMicrocontrollers176-BGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
26K x 16
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-BGA (15×15)
Package / Case:
176-BGA
1,119
TMS320F28232ZJZSTMS320F28232ZJZSTexas InstrumentsIC MCU 32BIT 128KB FLASH 176BGAMicrocontrollers176-BGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
26K x 16
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-BGA (15×15)
Package / Case:
176-BGA
82
TMS320F28234PGFATMS320F28234PGFATexas InstrumentsIC MCU 32BIT 256KB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
256KB (128K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
755
TMS320F28234PTPQTMS320F28234PTPQTexas InstrumentsIC MCU 32BIT 256KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
256KB (128K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,205
TMS320F28234PTPSTMS320F28234PTPSTexas InstrumentsIC MCU 32BIT 256KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
256KB (128K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
292
TMS320F28234ZAYATMS320F28234ZAYATexas InstrumentsIC MCU 32BIT 256KB FLSH 179NFBGAMicrocontrollers179-NFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
256KB (128K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
179-NFBGA (12×12)
Package / Case:
179-LFBGA
411
TMS320F28234ZHHATMS320F28234ZHHATexas InstrumentsIC MCU 32BIT 256KB FLASH 179BGAMicrocontrollers179-BGA MicroStar (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
256KB (128K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
179-BGA MicroStar (12×12)
Package / Case:
179-LFBGA
154
TMS320F28234ZJZATMS320F28234ZJZATexas InstrumentsIC MCU 32BIT 256KB FLASH 176BGAMicrocontrollers176-BGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
256KB (128K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-BGA (15×15)
Package / Case:
176-BGA
1,527
TMS320F28234ZJZQTMS320F28234ZJZQTexas InstrumentsIC MCU 32BIT 256KB FLASH 176BGAMicrocontrollers176-BGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
256KB (128K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-BGA (15×15)
Package / Case:
176-BGA
770
TMS320F28234ZJZSTMS320F28234ZJZSTexas InstrumentsIC MCU 32BIT 256KB FLASH 176BGAMicrocontrollers176-BGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
256KB (128K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-BGA (15×15)
Package / Case:
176-BGA
609
TMS320F28235PGFATMS320F28235PGFATexas InstrumentsIC MCU 32BIT 512KB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
589
TMS320F28235PTPQTMS320F28235PTPQTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
34K x 16
Voltage – Supply (Vcc/Vdd):
1.805V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
96

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