Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
TMS320LF2407APGEG4TMS320LF2407APGEG4Texas InstrumentsIC MCU 16BIT 64KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
C2xx DSP
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
5K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
529
TMS320LF2407APGESTMS320LF2407APGESTexas InstrumentsIC MCU 16BIT 64KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
C2xx DSP
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
5K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,189
TMS320R2811PBKATMS320R2811PBKATexas InstrumentsIC MCU 32BIT ROMLESS 128LQFPMicrocontrollers128-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
56
Program Memory Type:
ROMless
RAM Size:
20K x 16
Voltage – Supply (Vcc/Vdd):
1.81V ~ 2V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
128-LQFP (14×14)
Package / Case:
128-LQFP
11
TMS320R2811PBKQTMS320R2811PBKQTexas InstrumentsIC MCU 32BIT ROMLESS 128LQFPMicrocontrollers128-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
56
Program Memory Type:
ROMless
RAM Size:
20K x 16
Voltage – Supply (Vcc/Vdd):
1.81V ~ 2V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LQFP (14×14)
Package / Case:
128-LQFP
612
TMS320R2812GHHATMS320R2812GHHATexas InstrumentsIC MCU 32BIT ROMLESS 179BGAMicrocontrollers179-BGA MicroStar (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
56
Program Memory Type:
ROMless
RAM Size:
20K x 16
Voltage – Supply (Vcc/Vdd):
1.81V ~ 2V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
179-BGA MicroStar (12×12)
Package / Case:
179-LFBGA
1,088
TMS320R2812GHHQTMS320R2812GHHQTexas InstrumentsIC MCU 32BIT ROMLESS 179BGAMicrocontrollers179-BGA MicroStar (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
56
Program Memory Type:
ROMless
RAM Size:
20K x 16
Voltage – Supply (Vcc/Vdd):
1.81V ~ 2V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
179-BGA MicroStar (12×12)
Package / Case:
179-LFBGA
862
TMS320R2812GHHSTMS320R2812GHHSTexas InstrumentsIC MCU 32BIT ROMLESS 179BGAMicrocontrollers179-BGA MicroStar (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
56
Program Memory Type:
ROMless
RAM Size:
20K x 16
Voltage – Supply (Vcc/Vdd):
1.81V ~ 2V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
179-BGA MicroStar (12×12)
Package / Case:
179-LFBGA
491
TMS320R2812PGFATMS320R2812PGFATexas InstrumentsIC MCU 32BIT ROMLESS 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
56
Program Memory Type:
ROMless
RAM Size:
20K x 16
Voltage – Supply (Vcc/Vdd):
1.81V ~ 2V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
87
TMS320R2812PGFSTMS320R2812PGFSTexas InstrumentsIC MCU 32BIT ROMLESS 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
56
Program Memory Type:
ROMless
RAM Size:
20K x 16
Voltage – Supply (Vcc/Vdd):
1.81V ~ 2V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
949
TMS320R2812ZHHATMS320R2812ZHHATexas InstrumentsIC MCU 32BIT ROMLESS 179BGAMicrocontrollers179-BGA MicroStar (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
56
Program Memory Type:
ROMless
RAM Size:
20K x 16
Voltage – Supply (Vcc/Vdd):
1.81V ~ 2V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
179-BGA MicroStar (12×12)
Package / Case:
179-LFBGA
483
TMS32F240PQAG4N/ATMS32F240PQAG4Texas InstrumentsIC MCU 16BIT 32KB FLASH 132BQFPMicrocontrollers132-BQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
C2xx DSP
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
32KB (16K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-BQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
204
TMS32F28032LENAPNSTMS32F28032LENAPNSTexas InstrumentsIC MCU 32BIT 64KB FLASH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
60MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
10K x 16
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.995V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
369
TMS3472ADWTMS3472ADWTexas InstrumentsIC CCD DRIVER CMOS PDSO20Drivers, Receivers, TransceiversN/AN/AN/A

N/A

940
TMS3637DTMS3637DTexas InstrumentsIC TRANSMITTER/RECEIVER INFRAREDDrivers, Receivers, TransceiversN/AN/AN/A

N/A

1,120
TMS370C150AFNTTMS370C150AFNTTexas InstrumentsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
552
TMS370C156AFNTTMS370C156AFNTTexas InstrumentsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
702
TMS370C250AFNTTMS370C250AFNTTexas InstrumentsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Type:
ROMless
EEPROM Size:
256 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
306
TMS370C256AFNTTMS370C256AFNTTexas InstrumentsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
994
TMS370C686AFNTTMS370C686AFNTTexas Instruments8-BIT, OTPROM, TMS370 CPU, 5MHZMicrocontrollersN/AN/AN/A

N/A

1,855
TMS370C6C2AFNTTMS370C6C2AFNTTexas InstrumentsIC MCU 8BIT 8KB OTP 28PLCCMicrocontrollers28-PLCC (11.51x11.51)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 4x8b
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-PLCC (11.51×11.51)
Package / Case:
28-LCC (J-Lead)
921

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