Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AUPD70F3842F1-CAH-ARenesasIC MCU 32BIT 1MB FLASH 121BGAMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
83
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
121-LBGA
912
UPD70F3842GC-UEU-AXUPD70F3842GC-UEU-AXRenesasIC MCU 32BIT 1MB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
83
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
82
UPD70F3842GC(R)-UEU-AXN/AUPD70F3842GC(R)-UEU-AXRenesasIC MCU 32BIT 1MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
20MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
83
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
381
UPD70F3913GC(R)-UEU-AXUPD70F3913GC(R)-UEU-AXRenesasIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 12x10b, 7x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
501
UPD70F3913GF(R)-GAS-AXUPD70F3913GF(R)-GAS-AXRenesasIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 12x10b, 7x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
1,251
UPD70F3914GC(R)-UEU-AXUPD70F3914GC(R)-UEU-AXRenesasIC MCU 32BIT 384KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 12x10b, 7x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
302
UPD70F3914GF(R)-GAS-AXUPD70F3914GF(R)-GAS-AXRenesasIC MCU 32BIT 384KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 12x10b, 7x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
1,246
UPD70F3915GC(R)-UEU-AXUPD70F3915GC(R)-UEU-AXRenesasIC MCU 32BIT 480KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
480KB (480K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 12x10b, 7x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
1,981
UPD70F3915GF(R)-GAS-AXUPD70F3915GF(R)-GAS-AXRenesasIC MCU 32BIT 480KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
480KB (480K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 12x10b, 7x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
115
UPD70F3916GF(R)-GAT-AXUPD70F3916GF(R)-GAT-AXRenesasIC MCU 32BIT 256KB FLASH 128LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 12x10b, 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
273
UPD70F3917GF(R)-GAT-AXUPD70F3917GF(R)-GAT-AXRenesasIC MCU 32BIT 384KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 12x10b, 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
1,310
UPD70F3926AGMA-GAR-GN/AUPD70F3926AGMA-GAR-GRenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
156
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
76K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
267
UPD70F3939AGJA-GAE-GUPD70F3939AGJA-GAE-GRenesasIC MCU 32BIT 1MB FLASH 144LFQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
76K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
253
UPD70F3939BGJA-GAE-GUPD70F3939BGJA-GAE-GRenesasIC MCU 32BIT 1MB FLASH 144LFQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
76K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,978
UPD70F4000AM1GCA-UEU-AXUPD70F4000AM1GCA-UEU-AXRenesasIC MICROCONTROLLERMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, FlexRay, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
320
UPD70F4000AM1GCA-UEU-E2-QS-AXN/AUPD70F4000AM1GCA-UEU-E2-QS-AXRenesasIC MICROCONTROLLERMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, FlexRay, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
384
UPD70F4000M1GCA-UEU-AXN/AUPD70F4000M1GCA-UEU-AXRenesasIC MICROCONTROLLERMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, FlexRay, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,919
UPD70F4000M1GCA-UEU-E3-AXN/AUPD70F4000M1GCA-UEU-E3-AXRenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, FlexRay, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
34
UPD70F4018M1GMA-GAR-GN/AUPD70F4018M1GMA-GAR-GRenesasIC MCU 32BIT 2MB FLASH 144LFQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
446
N/AN/AUPD70F4021GM(R)-GBY-AXRenesasV850E2/ML4-L, 512KFLASH, 208PINMicrocontrollers216-LQFP (24x24)N/A-40°C ~ 100°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
120
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 100°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
216-LQFP (24×24)
Package / Case:
216-LQFP
931

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