Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC2VP2-5FGG256CXC2VP2-5FGG256CAdvanced Micro DevicesIC FPGA 140 I/O 256FBGAFPGAs256-FBGA (17x17)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
140
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Qualification:
N/A
Total RAM Bits:
221184
1,560
XC2VP2-5FGG256IXC2VP2-5FGG256IAdvanced Micro DevicesIC FPGA 140 I/O 256FBGAFPGAs256-FBGA (17x17)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
140
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Qualification:
N/A
Total RAM Bits:
221184
533
XC2VP2-5FGG456CXC2VP2-5FGG456CAdvanced Micro DevicesIC FPGA 156 I/O 456FBGAFPGAs456-FBGA (23x23)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Total RAM Bits:
221184
Number of I/O:
156
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
203
XC2VP2-5FGG456IXC2VP2-5FGG456IAdvanced Micro DevicesIC FPGA 156 I/O 456FBGAFPGAs456-FBGA (23x23)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
156
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Qualification:
N/A
Total RAM Bits:
221184
126
XC2VP2-6FF672CXC2VP2-6FF672CAdvanced Micro DevicesIC FPGA 204 I/O 672FCBGAFPGAs672-FCBGA (27x27)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Total RAM Bits:
221184
Number of I/O:
204
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FCBGA (27×27)
1,107
XC2VP2-6FF672IXC2VP2-6FF672IAdvanced Micro DevicesIC FPGA 204 I/O 672FCBGAFPGAs672-FCBGA (27x27)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
204
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Qualification:
N/A
Total RAM Bits:
221184
533
XC2VP2-6FFG672CXC2VP2-6FFG672CAdvanced Micro DevicesIC FPGA 204 I/O 672FCBGAFPGAs672-FCBGA (27x27)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
204
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Qualification:
N/A
Total RAM Bits:
221184
1,149
XC2VP2-6FFG672IXC2VP2-6FFG672IAdvanced Micro DevicesIC FPGA 204 I/O 672FCBGAFPGAs672-FCBGA (27x27)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Total RAM Bits:
221184
Number of I/O:
204
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FCBGA (27×27)
618
XC2VP2-6FG256CXC2VP2-6FG256CAdvanced Micro DevicesIC FPGA 140 I/O 256FBGAFPGAs256-FBGA (17x17)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
140
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Qualification:
N/A
Total RAM Bits:
221184
1,314
XC2VP2-6FG256IXC2VP2-6FG256IAdvanced Micro DevicesIC FPGA 140 I/O 256FBGAFPGAs256-FBGA (17x17)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Total RAM Bits:
221184
Number of I/O:
140
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
495
XC2VP2-6FG456CXC2VP2-6FG456CAdvanced Micro DevicesIC FPGA 156 I/O 456FBGAFPGAs456-FBGA (23x23)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
156
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Qualification:
N/A
Total RAM Bits:
221184
1,534
XC2VP2-6FG456IXC2VP2-6FG456IAdvanced Micro DevicesIC FPGA 156 I/O 456FBGAFPGAs456-FBGA (23x23)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Total RAM Bits:
221184
Number of I/O:
156
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
489
XC2VP2-6FGG256CXC2VP2-6FGG256CAdvanced Micro DevicesIC FPGA 140 I/O 256FBGAFPGAs256-FBGA (17x17)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Total RAM Bits:
221184
Number of I/O:
140
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
71
XC2VP2-6FGG256IXC2VP2-6FGG256IAdvanced Micro DevicesIC FPGA 140 I/O 256FBGAFPGAs256-FBGA (17x17)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
140
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Qualification:
N/A
Total RAM Bits:
221184
599
XC2VP2-6FGG456CXC2VP2-6FGG456CAdvanced Micro DevicesIC FPGA 156 I/O 456FBGAFPGAs456-FBGA (23x23)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Total RAM Bits:
221184
Number of I/O:
156
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
17
XC2VP2-7FGG256CXC2VP2-7FGG256CAdvanced Micro DevicesIC FPGA 140 I/O 256FBGAFPGAs256-FBGA (17x17)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
140
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Qualification:
N/A
Total RAM Bits:
221184
1,561
XC2VP20-5FF1152CXC2VP20-5FF1152CAdvanced Micro DevicesIC FPGA 564 I/O 1152FCBGAFPGAs1152-FCBGA (35x35)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
564
Number of LABs/CLBs:
2320
Number of Logic Elements/Cells:
20880
Qualification:
N/A
Total RAM Bits:
1622016
342
XC2VP20-5FF1152IXC2VP20-5FF1152IAdvanced Micro DevicesIC FPGA 564 I/O 1152FCBGAFPGAs1152-FCBGA (35x35)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
564
Number of LABs/CLBs:
2320
Number of Logic Elements/Cells:
20880
Qualification:
N/A
Total RAM Bits:
1622016
722
N/AXC2VP20-5FF896CAdvanced Micro DevicesIC FPGA 556 I/O 896FCBGAFPGAs896-FCBGA (31x31)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2320
Number of Logic Elements/Cells:
20880
Total RAM Bits:
1622016
Number of I/O:
556
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FCBGA (31×31)
585
XC2VP20-5FF896IXC2VP20-5FF896IAdvanced Micro DevicesIC FPGA 556 I/O 896FCBGAFPGAs896-FCBGA (31x31)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
556
Number of LABs/CLBs:
2320
Number of Logic Elements/Cells:
20880
Qualification:
N/A
Total RAM Bits:
1622016
144

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