DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,051
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MT46V32M16P-75:C TRN/AMT46V32M16P-75:C TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
750 ps
Clock Frequency:
133 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,379
MT46V32M16TG-5B IT:JMT46V32M16TG-5B IT:JAlliance Memory, Inc.IC DRAM 512MBIT PAR 66TSOP IIDRAM Memory66-TSOP II2.5V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
794
MT46V32M16TG-5B IT:J TRMT46V32M16TG-5B IT:J TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.5V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,644
MT46V32M16TG-5B IT:JTRMT46V32M16TG-5B IT:JTRAlliance Memory, Inc.IC DRAM 512MBIT PAR 66TSOP IIDRAM Memory66-TSOP II2.5V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,620
MT46V32M16TG-5B:CN/AMT46V32M16TG-5B:CMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.5V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
706
MT46V32M16TG-5B:C TRN/AMT46V32M16TG-5B:C TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.5V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,823
MT46V32M16TG-5B:FMT46V32M16TG-5B:FMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.5V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,254
MT46V32M16TG-5B:F TRMT46V32M16TG-5B:F TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.5V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
737
MT46V32M16TG-5B:JMT46V32M16TG-5B:JMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.5V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
931
MT46V32M16TG-5B:J TRMT46V32M16TG-5B:J TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.5V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
574
MT46V32M16TG-6T IT:FMT46V32M16TG-6T IT:FMicron Technology Inc.IC DRAM 512MBIT PAR 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
167 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,514
MT46V32M16TG-6T IT:F TRMT46V32M16TG-6T IT:F TRMicron Technology Inc.IC DRAM 512MBIT PAR 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
167 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
903
MT46V32M16TG-6T:CN/AMT46V32M16TG-6T:CMicron Technology Inc.IC DRAM 512MBIT PAR 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
167 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
951
MT46V32M16TG-6T:C TRN/AMT46V32M16TG-6T:C TRMicron Technology Inc.IC DRAM 512MBIT PAR 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
167 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,104
MT46V32M16TG-6T:FMT46V32M16TG-6T:FMicron Technology Inc.IC DRAM 512MBIT PAR 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
167 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,175
MT46V32M16TG-6T:F TRMT46V32M16TG-6T:F TRMicron Technology Inc.IC DRAM 512MBIT PAR 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
167 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,212
MT46V32M16TG-75 IT:CN/AMT46V32M16TG-75 IT:CMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
750 ps
Clock Frequency:
133 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
127
MT46V32M16TG-75 IT:C TRN/AMT46V32M16TG-75 IT:C TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
750 ps
Clock Frequency:
133 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
743
MT46V32M16TG-75 L:CN/AMT46V32M16TG-75 L:CMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
750 ps
Clock Frequency:
133 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
448
MT46V32M16TG-75 L:C TRN/AMT46V32M16TG-75 L:C TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 66TSOPDRAM Memory66-TSOP2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
750 ps
Clock Frequency:
133 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,453

Featured Brands

About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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