DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,051
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MT47H32M16CC-5E:B TRMT47H32M16CC-5E:B TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (12x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
600 ps
Clock Frequency:
200 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
536
MT47H32M16HR-187E:GMT47H32M16HR-187E:GMicron Technology Inc.IC DRAM 512MBIT PAR 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
350 ps
Clock Frequency:
533 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
558
N/AMT47H32M16HR-187E:G TRMicron Technology Inc.IC DRAM 512MBIT PAR 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
350 ps
Clock Frequency:
533 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
46
MT47H32M16HR-25E AAT:GMT47H32M16HR-25E AAT:GMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V-40°C ~ 105°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
AEC-Q100
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
145
N/AMT47H32M16HR-25E AAT:G TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V-40°C ~ 105°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
AEC-Q100
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
142
MT47H32M16HR-25E AIT:GMT47H32M16HR-25E AIT:GMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V-40°C ~ 95°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
AEC-Q100
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
1,111
N/AMT47H32M16HR-25E AIT:G TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V-40°C ~ 95°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
AEC-Q100
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
198
MT47H32M16HR-25E IT:GMT47H32M16HR-25E IT:GMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V-40°C ~ 95°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
1,303
MT47H32M16HR-25E IT:G TRMT47H32M16HR-25E IT:G TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V-40°C ~ 95°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
712
MT47H32M16HR-25E L:GMT47H32M16HR-25E L:GMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
1,202
N/AMT47H32M16HR-25E L:G TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
1,702
MT47H32M16HR-25E:GMT47H32M16HR-25E:GMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
387
N/AMT47H32M16HR-25E:G TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
937
MT47H32M16HR-3:FMT47H32M16HR-3:FMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
450 ps
Clock Frequency:
333 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
1,176
N/AMT47H32M16HR-3:GMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
450 ps
Clock Frequency:
333 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
217
N/AMT47H32M16HR-3:G TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
450 ps
Clock Frequency:
333 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
844
MT47H32M16HW-25E AAT:G TRMT47H32M16HW-25E AAT:G TRMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V-40°C ~ 105°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
AEC-Q100
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
314
MT47H32M16HW-25E IT:GMT47H32M16HW-25E IT:GMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V-40°C ~ 95°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
644
MT47H32M16HW-25E:GMT47H32M16HW-25E:GMicron Technology Inc.IC DRAM 512MBIT PARALLEL 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
278
MT47H32M16NF-187E:HMT47H32M16NF-187E:HMicron Technology Inc.IC DRAM 512MBIT PAR 84FBGADRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
350 ps
Clock Frequency:
533 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
32M x 16
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
1,443

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About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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