DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,051
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AS4C64M8D1-5BCNN/AAS4C64M8D1-5BCNAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 60FBGADRAM Memory60-FBGA (8x13)2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,072
AS4C64M8D1-5BCNTRN/AAS4C64M8D1-5BCNTRAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 60FBGADRAM Memory60-FBGA (8x13)2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
972
AS4C64M8D1-5BINN/AAS4C64M8D1-5BINAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 60FBGADRAM Memory60-FBGA (8x13)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
515
AS4C64M8D1-5BINTRN/AAS4C64M8D1-5BINTRAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 60FBGADRAM Memory60-FBGA (8x13)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
815
AS4C64M8D1-5TCNN/AAS4C64M8D1-5TCNAlliance Memory, Inc.IC DRAM 512MBIT PAR 66TSOP IIDRAM Memory66-TSOP II2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,239
AS4C64M8D1-5TCNTRN/AAS4C64M8D1-5TCNTRAlliance Memory, Inc.IC DRAM 512MBIT PAR 66TSOP IIDRAM Memory66-TSOP II2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,063
AS4C64M8D1-5TINN/AAS4C64M8D1-5TINAlliance Memory, Inc.IC DRAM 512MBIT PAR 66TSOP IIDRAM Memory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,010
AS4C64M8D1-5TINTRN/AAS4C64M8D1-5TINTRAlliance Memory, Inc.IC DRAM 512MBIT PAR 66TSOP IIDRAM Memory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
713
AS4C64M8D2-25BANN/AAS4C64M8D2-25BANAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 60FBGADRAM Memory60-FBGA (8x10)1.7V ~ 1.9V-40°C ~ 105°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
577
AS4C64M8D2-25BANTRN/AAS4C64M8D2-25BANTRAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 60FBGADRAM Memory60-FBGA (8x10)1.7V ~ 1.9V-40°C ~ 105°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
1,154
AS4C64M8D2-25BCNN/AAS4C64M8D2-25BCNAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 60FBGADRAM Memory60-FBGA (8x10)1.7V ~ 1.9V0°C ~ 70°C (TA)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
1,062
AS4C64M8D2-25BCNTRN/AAS4C64M8D2-25BCNTRAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 60FBGADRAM Memory60-FBGA (8x10)1.7V ~ 1.9V0°C ~ 70°C (TA)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
1,214
AS4C64M8D2-25BINN/AAS4C64M8D2-25BINAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 60FBGADRAM Memory60-FBGA (8x10)1.7V ~ 1.9V-40°C ~ 85°C (TA)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
1,418
AS4C64M8D2-25BINTRN/AAS4C64M8D2-25BINTRAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 60FBGADRAM Memory60-FBGA (8x10)1.7V ~ 1.9V-40°C ~ 85°C (TA)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
926
AS4C64M8D3-12BCNN/AAS4C64M8D3-12BCNAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 78FBGADRAM Memory78-FBGA (8x10.5)1.425V ~ 1.575V0°C ~ 95°C (TA)
Access Time:
20 ns
Clock Frequency:
800 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
78-VFBGA
Qualification:
N/A
Technology:
SDRAM - DDR3
Write Cycle Time Word Page:
N/A
1,079
AS4C64M8D3-12BCNTRN/AAS4C64M8D3-12BCNTRAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 78FBGADRAM Memory78-FBGA (8x10.5)1.425V ~ 1.575V0°C ~ 95°C (TA)
Access Time:
20 ns
Clock Frequency:
800 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
78-VFBGA
Qualification:
N/A
Technology:
SDRAM - DDR3
Write Cycle Time Word Page:
N/A
1,426
AS4C64M8D3-12BINN/AAS4C64M8D3-12BINAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 78FBGADRAM Memory78-FBGA (8x10.5)1.425V ~ 1.575V-40°C ~ 95°C (TA)
Access Time:
20 ns
Clock Frequency:
800 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
78-VFBGA
Qualification:
N/A
Technology:
SDRAM - DDR3
Write Cycle Time Word Page:
N/A
1,099
AS4C64M8D3-12BINTRN/AAS4C64M8D3-12BINTRAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 78FBGADRAM Memory78-FBGA (8x10.5)1.425V ~ 1.575V-40°C ~ 95°C (TA)
Access Time:
20 ns
Clock Frequency:
800 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
78-VFBGA
Qualification:
N/A
Technology:
SDRAM - DDR3
Write Cycle Time Word Page:
N/A
135
AS4C64M8D3L-12BCNAS4C64M8D3L-12BCNAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 78FBGADRAM Memory78-FBGA (8x10.5)1.283V ~ 1.45V0°C ~ 95°C (TA)
Access Time:
20 ns
Clock Frequency:
800 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
78-VFBGA
Qualification:
N/A
Technology:
SDRAM - DDR3
Write Cycle Time Word Page:
N/A
355
AS4C64M8D3L-12BCNTRAS4C64M8D3L-12BCNTRAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 78FBGADRAM Memory78-FBGA (8x10.5)1.283V ~ 1.45V0°C ~ 95°C (TA)
Access Time:
20 ns
Clock Frequency:
800 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
78-VFBGA
Qualification:
N/A
Technology:
SDRAM - DDR3
Write Cycle Time Word Page:
N/A
1,012

Featured Brands

About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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