Suntsu’s eMMC memory catalog includes reliable embedded multimedia card solutions designed for durable, compact storage in various applications, including automotive, IoT, medical, and embedded computing. Our eMMC storage chips combine integrated flash memory and an on-board controller in a single package, simplifying PCB design and enhancing data management efficiency. Use our advanced part search tool to filter by storage capacity, performance specifications, or manufacturer to find the perfect embedded storage solution for your project.
eMMC Memory
Total Products: 251
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | EMMC64G-IY29-5B102 | Kingston Technology | IC FLASH 512GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | N/A | -40°C ~ 85°C | Access Time: N/A Clock Frequency: N/A Grade: Industrial Memory Format: FLASH Memory Interface: eMMC_5.1 Memory Organization: 64G x 8 Memory Size: 512 Gbit Memory Type: Non-Volatile Packaging: 153-WFBGA Qualification: N/A Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 1,703 | ||
 | EMMC64G-IY29-5B111 | Kingston Technology | IC FLSH 512GBIT EMMC 5.1 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | N/A | -40°C ~ 85°C | Access Time: N/A Clock Frequency: N/A Grade: Industrial Memory Format: FLASH Memory Interface: eMMC_5.1 Memory Organization: 64G x 8 Memory Size: 512 Gbit Memory Type: Non-Volatile Packaging: 153-WFBGA Qualification: N/A Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 1,009 | ||
| N/A | EMMC64G-TB9F-03B11 | Kingston Technology | IC FLASH 256GBIT EMMC 153VFBGA | eMMC Memory | 153-FBGA (8x8.5) | 2.7V ~ 3.6V | -25°C ~ 85°C | Access Time: N/A Clock Frequency: 200 MHz Grade: Industrial Memory Format: FLASH Memory Interface: eMMC_5.1 Memory Organization: 64G x 8 Memory Size: 512 Gbit Memory Type: Non-Volatile Packaging: 153-WFBGA Qualification: N/A Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 529 | ||
 | EMMC64G-TY29-5B101 | Kingston Technology | IC FLASH 512GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | N/A | -25°C ~ 85°C | Access Time: N/A Clock Frequency: N/A Grade: Industrial Memory Format: FLASH Memory Interface: eMMC Memory Organization: 64G x 8 Memory Size: 512 Gbit Memory Type: Non-Volatile Packaging: 153-WFBGA Qualification: N/A Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 134 | ||
 | EMMC64G-TY29-5B102 | Kingston Technology | IC FLASH 512GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -25°C ~ 85°C | Access Time: N/A Clock Frequency: 200 MHz Grade: Industrial Memory Format: FLASH Memory Interface: eMMC_5.1 Memory Organization: 64G x 8 Memory Size: 512 Gbit Memory Type: Non-Volatile Packaging: 153-WFBGA Qualification: N/A Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 127 | ||
 | EMMC64G-TY29-5B111 | Kingston Technology | IC FLASH 512GBIT EMMC 153WFBGA | eMMC Memory | 153-FBGA (11.5x13) | 1.8V, 3.3V | -25°C ~ 85°C | Access Time: N/A Clock Frequency: N/A Grade: Industrial Memory Format: FLASH Memory Interface: eMMC Memory Organization: 64G x 8 Memory Size: 512 Gbit Memory Type: Non-Volatile Packaging: 153-WFBGA Qualification: N/A Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 276 | ||
| N/A | FC51E08SQP1A (2A) | ESMT | 64Gb Memory Ind. | eMMC Memory | 153 ball BGA | 2.5V | -40°C – 85°C | Memory Size: 64 Gbit Clock Frequency: 200 MHz Write Cycle Time Word Page: N/A Access Time: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: eMMC Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Qualification: N/A Packaging: 153 ball BGA | 223 | ||
| N/A | FC51J32SJTS2A (2D) | ESMT | 256Gb Memory Ind. | eMMC Memory | 153 ball BGA | 2.5V | -40°C – 85°C | Memory Size: 256 Gbit Clock Frequency: 200 MHz Write Cycle Time Word Page: N/A Access Time: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: eMMC Memory Organization: 32G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Qualification: N/A Packaging: 153 ball BGA | 663 | ||
| N/A | FC51J32SJTS2A-2.5BWGE2D | ESMT | eMMC Flash 3.3V 32 GByte - eMMC Flash Memory | eMMC Memory | 153-ball BGA | 2.7 V to 3.6 V | -25°C to +85°C | JEDEC Standard: eMMC Electrical Standard 5.1 LBA (Hex/ Dec): 0x039EC000 / 60,735,488 Bus Width: 1-bit (default), 4-bit, 8-bit Max Clock Speed Ordering: 200 MHz (Ordering table); HS200/HS400 timing tables included Sequential Read (HS400, 8-Bit): 250 MB/s Sequential Write (HS400, 8-Bit): 210 MB/s Memory Size: 32 GB (31,096,569,856 bytes) Memory Type: eMMC Flash Memory Operating Temperature: -25°C to +85°C I/O Supply (VCCQ): 1.70 – 1.95 V or 2.7 – 3.6 V Storage Temperature: -40°C to +85°C Boot Partition 1: 4096 KB Boot Partition 2: 4096 KB RPMB: 4096 KB Large Sector Size Support: Not supported (4 KB) Package: 153-ball BGA Package Dimensions: 11.5 mm x 13.0 mm body; max height 1.0 mm Ball Pitch: 0.50 mm (BSC) Pb Free: Yes (per ordering info) | 1,305 | ||
| N/A | FC51J32SJTS2A-2.5BWGI2D | ESMT | eMMC Flash 3.3V 32 GByte - eMMC Flash Memory | eMMC Memory | 153-ball BGA | 2.7 V to 3.6 V | -40°C to +85°C | JEDEC Standard: eMMC Electrical Standard 5.1 LBA (Hex/ Dec): 0x039EC000 / 60,735,488 Bus Width: 1-bit (default), 4-bit, 8-bit Max Clock Speed Ordering: 200 MHz (Ordering table); HS200/HS400 timing tables included Sequential Read (HS400, 8-Bit): 250 MB/s Sequential Write (HS400, 8-Bit): 210 MB/s Memory Size: 32 GB (31,096,569,856 bytes) Memory Type: eMMC Flash Memory Operating Temperature: -40°C to +85°C I/O Supply (VCCQ): 1.70 – 1.95 V or 2.7 – 3.6 V Storage Temperature: -40°C to +85°C Boot Partition 1: 4096 KB Boot Partition 2: 4096 KB RPMB: 4096 KB Large Sector Size Support: Not supported (4 KB) Package: 153-ball BGA Package Dimensions: 11.5 mm x 13.0 mm body; max height 1.0 mm Ball Pitch: 0.50 mm (BSC) Pb Free: Yes (per ordering info) | 1,576 | ||
 | FEMC004GPA-E440 | Flexxon | XTRA III 5.1 153ball eMMC (MLC/pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 32 Gbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: pSLC Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 3 Packaging: 153-FBGA Qualification: AEC-Q100 Grade 3 | 247 | ||
| FEMC004GPB-E440 | Flexxon | XTRA III 5.1 153ball eMMC (MLC/pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 32 Gbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: pSLC Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 2 Packaging: 153-FBGA Qualification: AEC-Q100 Grade 2 | 961 | ||
 | FEMC004GPE-E430 | Flexxon | XTRA III 5.1 100ball eMMC (MLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 32 Gbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: pSLC Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 100-FBGA Qualification: N/A | 1,279 | ||
| FEMC004GPE-E440 | Flexxon | XTRA III 5.1 153ball eMMC (MLC/pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 32 Gbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: pSLC Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 153-FBGA Qualification: N/A | 1,043 | ||
| FEMC004GPG-E430 | Flexxon | XTRA III 5.1 100ball eMMC (MLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 32 Gbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: pSLC Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 100-FBGA Qualification: N/A | 754 | ||
| FEMC004GPG-E440 | Flexxon | XTRA III 5.1 153ball eMMC (MLC/pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 32 Gbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: pSLC Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 153-FBGA Qualification: N/A | 1,530 | ||
| FEMC008G-M10 | Flexxon | ECON II 5.1 153ball eMMC (3D TLC/MLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 64 Gbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: MLC Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 Grade: Commercial Packaging: 153-FBGA Qualification: N/A | 69 | ||
| FEMC008GBE-T740 | Flexxon | XTRA VII 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 64 Gbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 153-FBGA Qualification: N/A | 693 | ||
| FEMC008GCA-T740 | Flexxon | XTRA VIII 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -40°C - 85°C | Memory Size: 64 Gbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D pSLC Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 3 Packaging: 153-FBGA Qualification: AEC-Q100 Grade 3 | 369 | ||
| FEMC008GCB-T740 | Flexxon | XTRA VIII 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -40°C - 105°C | Memory Size: 64 Gbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D pSLC Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 2 Packaging: 153-FBGA Qualification: AEC-Q100 Grade 2 | 852 |
About eMMC Memory
Embedded MultiMediaCard (eMMC) memory is an advanced, non-volatile storage solution that combines NAND flash memory and an intelligent on-board controller within a compact Ball Grid Array (BGA) package. By handling essential flash operations internally—such as error correction code (ECC), wear leveling, and bad block management—eMMC chips reduce the processing load on the host microcontroller or microprocessor. This design offers hardware engineers a reliable, plug-and-play storage option that simplifies circuit design and speeds up the time-to-market compared to discrete flash components.
eMMC memory is optimized for high-density storage and reliable data retention during power cycles. It is commonly used in embedded systems, automotive infotainment, industrial automation, medical devices, and IoT hardware. When choosing an eMMC solution, engineers focus on factors such as storage capacity, interface speeds, and specialized features like operating temperature ranges suitable for harsh environments. Suntsu offers a versatile range of eMMC memory ICs designed to provide durable and cost-effective solutions for boot code and data storage, ensuring compatibility with modern digital logic devices.
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