Suntsu offers a comprehensive catalog of flash memory solutions designed for various applications, including industrial, consumer electronics, automotive, and telecommunications. Our selection features high-density NAND flash, high-speed NOR flash, and secure serial flash chips, all engineered to ensure reliable data retention and meet stringent performance and endurance standards. You can utilize our advanced part search tool to filter options by memory size, interface type, or package configuration, helping you find the ideal flash memory component for your project.
Flash Memory
Total Products: 66
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | N/A | FBFS256GBE-EA40 | Flexxon | BGA UFS 2.2 | Flash Memory | 153 BGA | N/A | -40°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: UFS 2.2 Grade: Industrial Packaging: 11.5x13x1.4mm Qualification: N/A | 1,218 | |
| N/A | FBFS256GBE-EB40 | Flexxon | BGA UFS 3.1 | Flash Memory | 153 FBGA | N/A | -40°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: UFS 3.1 Grade: Industrial Packaging: 11.5x13x1.4mm Qualification: N/A | 640 | |
| N/A | FBFS256GBG-EA40 | Flexxon | BGA UFS 2.2 | Flash Memory | 153 BGA | N/A | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: UFS 2.2 Grade: Industrial Packaging: 11.5x13x1.4mm Qualification: N/A | 239 | |
| N/A | FBFS256GBG-EB40 | Flexxon | BGA UFS 3.1 | Flash Memory | 153 FBGA | N/A | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: UFS 3.1 Grade: Industrial Packaging: 11.5x13x1.4mm Qualification: N/A | 773 | |
| N/A | FBFS512GBA-EA40 | Flexxon | BGA UFS 2.2 | Flash Memory | 153 BGA | N/A | -40°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: UFS 2.2 Grade: Automotive grade 3 Packaging: 11.5x13x1.52mm Qualification: AEC-Q100 Grade 3 | 872 | |
| N/A | FBFS512GBA-EB40 | Flexxon | BGA UFS 3.1 | Flash Memory | 153 FBGA | N/A | -40°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: UFS 3.1 Grade: Automotive grade 3 Packaging: 11.5x13x1.52mm Qualification: AEC-Q100 Grade 3 | 720 | |
| N/A | FBFS512GBB-EA40 | Flexxon | BGA UFS 2.2 | Flash Memory | 153 BGA | N/A | -40°C - 105°C | Memory Size: 4.096 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: UFS 2.2 Grade: Automotive grade 2 Packaging: 11.5x13x1.52mm Qualification: AEC-Q100 Grade 2 | 871 | |
| N/A | FBFS512GBB-EB40 | Flexxon | BGA UFS 3.1 | Flash Memory | 153 FBGA | N/A | -40°C - 105°C | Memory Size: 4.096 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: UFS 3.1 Grade: Automotive grade 2 Packaging: 11.5x13x1.52mm Qualification: AEC-Q100 Grade 2 | 908 | |
| N/A | FBFS512GBE-EA40 | Flexxon | BGA UFS 2.2 | Flash Memory | 153 BGA | N/A | -40°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: UFS 2.2 Grade: Industrial Packaging: 11.5x13x1.52mm Qualification: N/A | 85 | |
| N/A | FBFS512GBE-EB40 | Flexxon | BGA UFS 3.1 | Flash Memory | 153 FBGA | N/A | -40°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: UFS 3.1 Grade: Industrial Packaging: 11.5x13x1.52mm Qualification: N/A | 428 | |
| N/A | FBFS512GBG-EA40 | Flexxon | BGA UFS 2.2 | Flash Memory | 153 BGA | N/A | -25°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: UFS 2.2 Grade: Industrial Packaging: 11.5x13x1.52mm Qualification: N/A | 305 | |
| N/A | FBFS512GBG-EB40 | Flexxon | BGA UFS 3.1 | Flash Memory | 153 FBGA | N/A | -25°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: UFS 3.1 Grade: Industrial Packaging: 11.5x13x1.52mm Qualification: N/A | 25 | |
 | FDME001GSE-N330 | Flexxon | eSD Memory Card (MLC/pSLC/SLC) | Flash Memory | 100-BGA | 2.7 ~ 3.6V | -40°C - 85°C | Memory Size: 8 Gbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: SLC Memory Organization: N/A Memory Interface: SD 2.0/3.0 Grade: Industrial Packaging: 100-BGA Qualification: N/A | 222 | ||
| FDME002GSE-N330 | Flexxon | eSD Memory Card (MLC/pSLC/SLC) | Flash Memory | 100-BGA | 2.7 ~ 3.6V | -40°C - 85°C | Memory Size: 16 Gbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: SLC Memory Organization: N/A Memory Interface: SD 2.0/3.0 Grade: Industrial Packaging: 100-BGA Qualification: N/A | 685 | ||
| FDME004GPE-N230 | Flexxon | eSD Memory Card (MLC/pSLC/SLC) | Flash Memory | 100-BGA | 2.7 ~ 3.6V | -40°C - 85°C | Memory Size: 32 Gbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: pSLC Memory Organization: N/A Memory Interface: SD 2.0/3.0 Grade: Industrial Packaging: 100-BGA Qualification: N/A | 1,725 | ||
| FDME004GPG-N230 | Flexxon | eSD Memory Card (MLC/pSLC/SLC) | Flash Memory | 100-BGA | 2.7 ~ 3.6V | -25°C - 85°C | Memory Size: 32 Gbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: pSLC Memory Organization: N/A Memory Interface: SD 2.0/3.0 Grade: Industrial Packaging: 100-BGA Qualification: N/A | 465 | ||
| N/A | FDME004GSE-N230 | Flexxon | eSD Memory Card (MLC/pSLC/SLC) | Flash Memory | 100-BGA | 2.7 ~ 3.6V | -40°C - 85°C | Memory Size: 32 Gbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: SLC Memory Organization: N/A Memory Interface: SD 2.0/3.0 Grade: Industrial Packaging: 100-BGA Qualification: N/A | 511 | |
| FDME008GME-N230 | Flexxon | eSD Memory Card (MLC/pSLC/SLC) | Flash Memory | 100-BGA | 2.7 ~ 3.6V | -40°C - 85°C | Memory Size: 64 Gbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: MLC Memory Organization: N/A Memory Interface: SD 2.0/3.0 Grade: Industrial Packaging: 100-BGA Qualification: N/A | 1,220 | ||
| FDME008GMG-N230 | Flexxon | eSD Memory Card (MLC/pSLC/SLC) | Flash Memory | 100-BGA | 2.7 ~ 3.6V | -25°C - 85°C | Memory Size: 64 Gbit Clock Frequency: 25 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: MLC Memory Organization: N/A Memory Interface: SD 2.0/3.0 Grade: Industrial Packaging: 100-BGA Qualification: N/A | 353 | ||
| FDME008GPE-N230 | Flexxon | eSD Memory Card (MLC/pSLC/SLC) | Flash Memory | 100-BGA | 2.7 ~ 3.6V | -40°C - 85°C | Memory Size: 64 Gbit Clock Frequency: N/A Memory Type: Non-Volatile Memory Format: FLASH Technology: pSLC Memory Organization: N/A Memory Interface: SD 2.0/3.0 Grade: Industrial Packaging: 100-BGA Qualification: N/A | 187 |
About Flash Memory
Flash memory is a type of non-volatile, solid-state semiconductor storage technology that retains data permanently, even without power. It operates using electrically erasable programmable read-only memory (EEPROM) technology, which allows data to be written, read, and erased in large blocks rather than one byte at a time. This results in excellent read-write efficiency.
Flash memory can be divided into two main architectures: NOR flash and NAND flash. NOR flash is known for its fast random-read capabilities, making it ideal for direct code execution and firmware storage. On the other hand, NAND flash offers high storage density and quick write/erase times, making it well-suited for mass data storage and file systems.
Engineers select flash memory integrated circuits (ICs) based on key performance parameters, including memory density, interface type (such as SPI, Quad SPI, or parallel), write endurance, and the ability to operate in extended temperature ranges. Flash memory is a vital component in various fields, including industrial automation, automotive electronics, medical imaging, and consumer devices. It serves as the primary medium for boot code, firmware, and telemetry data logging. Suntsu’s range of robust flash memory chips provides the durability and high-speed data throughput required to support advanced microcontrollers and FPGAs in demanding embedded system architectures.
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