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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | LPC2292FET144,551 | NXP Semiconductors | IC MCU 16/32BIT 256KB 144TFBGA | Microcontrollers | 144-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 60MHz Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 112 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TFBGA (12×12) Package / Case: 144-TFBGA | 1,574 | ||
 | LPC2292FET144/01,5 | NXP Semiconductors | IC MCU 16/32BIT 256KB 144TFBGA | Microcontrollers | 144-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 60MHz Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 112 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TFBGA (12×12) Package / Case: 144-TFBGA | 598 | ||
 | LPC2294HBD144,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 60MHz Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 112 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 717 | ||
 | LPC2294HBD144/01,5 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 60MHz Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 112 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 460 | ||
 | LPC2294HBD144/01K | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 60MHz Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 112 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: A/D 8x10b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 1,025 | ||
 | LPC2294JBD144,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 60MHz Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 112 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 1,417 | ||
 | LPC2361FBD100,551 | NXP Semiconductors | IC MCU 16/32B 64KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 34K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 908 | ||
 | LPC2362FBD100,551 | NXP Semiconductors | IC MCU 16/32B 128KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 58K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 613 | ||
 | LPC2364FBD100,551 | NXP Semiconductors | IC MCU 16/32B 128KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 34K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 320 | ||
 | LPC2364FBD100K | NXP Semiconductors | IC MCU 16/32B 128KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 34K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b SAR; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 771 | ||
 | LPC2364FET100,518 | NXP Semiconductors | IC MCU 16/32BIT 128KB 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 34K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) Package / Case: 100-TFBGA | 3 | ||
 | LPC2364HBD100,551 | NXP Semiconductors | IC MCU 16/32B 128KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 34K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 791 | ||
 | LPC2365FBD100,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 58K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 1,554 | ||
 | LPC2366FBD100,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 58K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 265 | ||
 | LPC2366FBD100K | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 58K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b SAR; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 563 | ||
 | LPC2367FBD100,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 58K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 374 | ||
| N/A | LPC2368FBD100,518 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7TDMI-S Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 58K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b SAR; D/A 1x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 30 | ||
 | LPC2368FBD100,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 58K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 1,425 | ||
 | LPC2368FBD100K | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 58K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) Package / Case: 100-LQFP | 1,475 | ||
 | LPC2368FET100,518 | NXP Semiconductors | IC MCU 16/32BIT 512KB 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 58K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) Package / Case: 100-TFBGA | 1,550 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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