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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | LPC54S016JET180E | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 145 Program Memory Type: ROMless RAM Size: 360K x 8 Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) Package / Case: 180-TFBGA | 1,949 | ||
![]() | LPC54S018J2MET180E | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 137 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 360K x 8 Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) Package / Case: 180-TFBGA | 1,976 | ||
![]() | LPC54S018J4MET180E | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 137 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 360K x 8 Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) Package / Case: 180-TFBGA | 297 | ||
![]() | LPC54S018JBD208E | NXP Semiconductors | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 171 Program Memory Type: ROMless RAM Size: 360K x 8 Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) Package / Case: 208-LQFP | 1,001 | ||
![]() | LPC54S018JET180E | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 145 Program Memory Type: ROMless RAM Size: 360K x 8 Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) Package / Case: 180-TFBGA | 567 | ||
![]() | LPC54S018JET180K | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 145 Program Memory Type: ROMless EEPROM Size: 16K x 8 RAM Size: 360K x 8 Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) Package / Case: 180-TFBGA | 444 | ||
| N/A | LPC54S018JET180Y | NXP Semiconductors | POWER-EFFICIENT MICROCONTROLLERS | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 145 Program Memory Type: ROMless RAM Size: 360K x 8 Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) Package / Case: 180-TFBGA | 627 | ||
![]() | LPC5502JBD64E | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 1,384 | ||
| N/A | LPC5502JBD64K | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 64TQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 1,562 | ||
| N/A | LPC5502JBD64Y | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 64TQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 544 | ||
![]() | LPC5502JHI48EL | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 48VFQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 30 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 7x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 222 | ||
![]() | LPC5502JHI48J | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 48VFQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 30 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 7x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 398 | ||
![]() | LPC5502JHI48QL | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 48HVQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 30 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 7x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 152 | ||
![]() | LPC5504JBD64E | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 80K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 315 | ||
| N/A | LPC5504JBD64K | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 80K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 1,200 | ||
| N/A | LPC5504JBD64Y | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 80K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 787 | ||
![]() | LPC5504JHI48EL | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 48HVQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 30 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 80K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 7x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,057 | ||
![]() | LPC5504JHI48J | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 48HVQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 30 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 80K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 7x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,587 | ||
![]() | LPC5504JHI48QL | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 48HVQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 30 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 80K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 7x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 275 | ||
![]() | LPC5506JBD64E | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 96K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 275 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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