Microcontrollers

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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
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LPC8N04FHI24ELPC8N04FHI24ENXP SemiconductorsIC MCU 32BIT 32KB FLASH 24HVQFNMicrocontrollers24-HVQFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
8MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-HVQFN (4×4)
Package / Case:
24-VFQFN Exposed Pad
1,104
LPC8N04FHI24ZLPC8N04FHI24ZNXP SemiconductorsIC MCU 32BIT 32KB FLASH 24HVQFNMicrocontrollers24-HVQFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
8MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-HVQFN (4×4)
Package / Case:
24-VFQFN Exposed Pad
1,996
LX4F230H5QRFIGB0LX4F230H5QRFIGB0Texas InstrumentsIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.63V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
427
LX4F231H5QRFIGA3LX4F231H5QRFIGA3Texas InstrumentsIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.63V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,524
LX4F231H5QRFIGB0LX4F231H5QRFIGB0Texas InstrumentsIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.63V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,505
LX4F232H5BBFIGB0LX4F232H5BBFIGB0Texas InstrumentsIC MCU 32BIT 256KB FLASH 157BGAMicrocontrollers157-BGA Microstar Junior (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.63V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
157-BGA Microstar Junior (9×9)
Package / Case:
157-VFBGA
1,008
LX4F232H5QCFIGA3LX4F232H5QCFIGA3Texas InstrumentsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
69
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.63V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,433
LX4F232H5QCFIGB0LX4F232H5QCFIGB0Texas InstrumentsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
69
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.63V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
552
LX4F232H5QDFIGA3LX4F232H5QDFIGA3Texas InstrumentsIC MCU 32BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.63V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
109
N/AN/AM0L1304QDGS20RQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers20-VSSOP1.62V - 3.6V-40°C – 125°C
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Program Memory Size:
16KB (16K x 8)
Mounting Type:
Surface Mount
582
N/AN/AM0L1304QDGS28RQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers28-VSSOP1.62V - 3.6V-40°C – 125°C
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Program Memory Size:
16KB (16K x 8)
Mounting Type:
Surface Mount
64
N/AM0L1304QDYYRQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers16-SOT-23-THINN/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
13
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 6x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOT-23-THIN
Package / Case:
SOT-23-16 Thin, SOT-23 Variant
1,030
N/AM0L1304QRGERQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers24-VQFN (4x4)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
20
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
24-VQFN (4×4)
Package / Case:
24-VFQFN Exposed Pad
782
M0L1304QRHBRQ1M0L1304QRHBRQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
28
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
604
N/AN/AM0L1305QDGS20RQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers20-VSSOP1.62V - 3.6V-40°C – 125°C
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Program Memory Size:
32KB (32K x 8)
Mounting Type:
Surface Mount
1,724
N/AN/AM0L1305QDGS28RQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers28-VSSOP1.62V - 3.6V-40°C – 125°C
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Program Memory Size:
32KB (32K x 8)
Mounting Type:
Surface Mount
31
N/AM0L1305QDYYRQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers16-SOT-23-THINN/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
13
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 6x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOT-23-THIN
Package / Case:
SOT-23-16 Thin, SOT-23 Variant
599
N/AM0L1305QRGERQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers24-VQFN (4x4)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
20
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
24-VQFN (4×4)
Package / Case:
24-VFQFN Exposed Pad
168
M0L1305QRHBRQ1M0L1305QRHBRQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
787
N/AN/AM0L1306QDGS20RQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers20-VSSOP1.62V - 3.6V-40°C – 125°C
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Program Memory Size:
64KB (64K x 8)
Mounting Type:
Surface Mount
992

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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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