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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,657
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MB9DF125EPMC-GSK5E2
MB9DF125EPMC-GSK5E2Infineon TechnologiesIC MCU 32BIT 1MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4
Core Size:
32-Bit Single-Core
Speed:
128MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
141
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 50x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
1,301
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MB9DF126BPMC-GSK5E2
MB9DF126BPMC-GSK5E2Infineon TechnologiesIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4
Core Size:
32-Bit Single-Core
Speed:
128MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
141
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
208K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 50x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
1,011
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MB9DF126PMC-GSK5E2
MB9DF126PMC-GSK5E2Infineon TechnologiesIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4
Core Size:
32-Bit Single-Core
Speed:
128MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
141
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
208K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 50x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
62
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N/AN/AMB9DF566MABEQ-GTK5E1Infineon TechnologiesIC MCU 32B 2.25MB FLASH 208TEQFPMicrocontrollers208-TEQFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
125
Program Memory Size:
2.25MB (2.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 40x12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TEQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
1,184
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N/AN/AMB9DF566MADEQ-GTK5E1Infineon TechnologiesIC MCU 32B 2.25MB FLASH 208TEQFPMicrocontrollers208-TEQFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
125
Program Memory Size:
2.25MB (2.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 40x12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TEQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
913
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N/A
MB9DF566MAEEQ-GTK5E1Infineon TechnologiesIC MCU 32B 2.25MB FLASH 208TEQFPMicrocontrollers208-TEQFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
125
Program Memory Size:
2.25MB (2.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 40x12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TEQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
147
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N/AN/AMB9DF566MGBEQ-GTK5E1Infineon TechnologiesIC MCU 32B 2.25MB FLASH 208TEQFPMicrocontrollers208-TEQFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
125
Program Memory Size:
2.25MB (2.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 40x12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TEQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
60
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MB9EF226BPMC-GSE2-HTVN/AMB9EF226BPMC-GSE2-HTVInfineon TechnologiesIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4
Core Size:
32-Bit Single-Core
Speed:
128MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
117
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
208K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 50x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
339
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MB9EF226PMC-GSK5E2
MB9EF226PMC-GSK5E2Infineon TechnologiesIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4
Core Size:
32-Bit Single-Core
Speed:
128MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
117
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
208K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 50x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
1,726
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N/AN/AMC-10047F1-JN5-ARenesasIC MCU 32BIT FLASH SMDMicrocontrollersN/AN/AN/A

N/A

99
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MC-10287BF1-HN4-A#YB1N/AMC-10287BF1-HN4-A#YB1RenesasIC MCU 32B 768KB ROMLESS 324BGAMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, SCI, UART/USART
Peripherals:
DMA, WDT
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
ROMless
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
406
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MC-10287BF1-HN4-A#YK1N/AMC-10287BF1-HN4-A#YK1RenesasIC MCU 32B 768KB ROMLESS 324BGAMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, SCI, UART/USART
Peripherals:
DMA, WDT
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
ROMless
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
166
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MC-10287BF1-HN4-M1-A
MC-10287BF1-HN4-M1-ARenesasIC MCU 32BIT 768KB ROMLSS 324BGAMicrocontrollers324-BGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, SCI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
96
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
ROMless
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-BGA (19×19)
Package / Case:
324-BGA
767
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N/AN/AMC-10287F1-HN4-A#YB2RenesasIC MCU 32B 768KB ROMLESS 324BGAMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, SCI, UART/USART
Peripherals:
DMA, WDT
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
ROMless
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
467
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N/AN/AMC-10287F1-HN4-A#YK3RenesasIC MCU 32B 768KB ROMLESS 324BGAMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, SCI, UART/USART
Peripherals:
DMA, WDT
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
ROMless
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
1,779
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MC-10287F1-HN4-M1-A
MC-10287F1-HN4-M1-ARenesasIC MCU 32BIT 768KB ROMLSS 324BGAMicrocontrollers324-BGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, SCI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
96
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
ROMless
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-BGA (19×19)
Package / Case:
324-BGA
756
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MC11E1CPBE2
MC11E1CPBE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52TQFPMicrocontrollers52-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-TQFP (10×10)
Package / Case:
52-LQFP
698
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MC56F8002VWL
MC56F8002VWLNXP SemiconductorsIC MCU 16BIT 12KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
12KB (6K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,831
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MC56F8002VWLR
MC56F8002VWLRNXP SemiconductorsIC MCU 16BIT 12KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
12KB (6K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
948
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MC56F8006MLC
MC56F8006MLCNXP SemiconductorsIC MCU 16BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
27
Program Memory Size:
16KB (8K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 18x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,105
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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