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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC68HC11E0CFNE3 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 800 | ||
 | MC68HC11E0CFNE3R | NXP Semiconductors | IC MCU 8BIT ROMLESS 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 1,615 | ||
 | MC68HC11E0MFNE2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 125°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 1,353 | ||
 | MC68HC11E1CFN2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 107 | ||
 | MC68HC11E1CFN2R2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 802 | ||
 | MC68HC11E1CFN3 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 532 | ||
 | MC68HC11E1CFNE2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 1,150 | ||
 | MC68HC11E1CFNE2R | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 1,389 | ||
 | MC68HC11E1CFNE3 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 185 | ||
 | MC68HC11E1CFNE3R | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 961 | ||
 | MC68HC11E1MFNE3 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 125°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 802 | ||
 | MC68HC11E1VFNE3 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 105°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 627 | ||
 | MC68HC11E1VFNE3R | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 105°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 645 | ||
 | MC68HC11E9BCFNE2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 1,120 | ||
 | MC68HC11F1CFN2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 1,274 | ||
 | MC68HC11F1CFN3 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 678 | ||
 | MC68HC11F1CFN3R2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 624 | ||
 | MC68HC11F1CFN4 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 28 | ||
 | MC68HC11F1CFN4R2 | NXP Semiconductors | IC MCU 8BIT ROMLESS 68PLCC | Microcontrollers | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-PLCC (24.21×24.21) Package / Case: 68-LCC (J-Lead) | 1,756 | ||
 | MC68HC11F1CPU4 | NXP Semiconductors | IC MCU 8BIT ROMLESS 80LQFP | Microcontrollers | 80-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (14×14) Package / Case: 80-QFP | 1,297 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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