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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,657
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MC9S12GC32CPBE
MC9S12GC32CPBENXP SemiconductorsIC MCU 16BIT 32KB FLASH 52TQFPMicrocontrollers52-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-TQFP (10×10)
Package / Case:
52-LQFP
1,077
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MC9S12GC32MFAE
MC9S12GC32MFAENXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
386
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MC9S12GC32MFUE
MC9S12GC32MFUENXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
354
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MC9S12GC32MPBE
MC9S12GC32MPBENXP SemiconductorsIC MCU 16BIT 32KB FLASH 52TQFPMicrocontrollers52-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-TQFP (10×10)
Package / Case:
52-LQFP
379
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MC9S12GC32VFAE
MC9S12GC32VFAENXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
660
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MC9S12GC64CFAE
MC9S12GC64CFAENXP SemiconductorsIC MCU 16BIT 64KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
966
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MC9S12GC64CFUE
MC9S12GC64CFUENXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,556
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MC9S12GC64MFAE
MC9S12GC64MFAENXP SemiconductorsIC MCU 16BIT 64KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,856
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MC9S12GC64MFUE
MC9S12GC64MFUENXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,007
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MC9S12GC64MPBE
MC9S12GC64MPBENXP SemiconductorsIC MCU 16BIT 64KB FLASH 52TQFPMicrocontrollers52-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-TQFP (10×10)
Package / Case:
52-LQFP
670
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MC9S12GC96CFAE
MC9S12GC96CFAENXP SemiconductorsIC MCU 16BIT 96KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
371
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MC9S12GC96CFUE
MC9S12GC96CFUENXP SemiconductorsIC MCU 16BIT 96KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
512
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MC9S12GC96CPBE
MC9S12GC96CPBENXP SemiconductorsIC MCU 16BIT 96KB FLASH 52TQFPMicrocontrollers52-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-TQFP (10×10)
Package / Case:
52-LQFP
388
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MC9S12GC96MFAE
MC9S12GC96MFAENXP SemiconductorsIC MCU 16BIT 96KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
274
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MC9S12GC96MFUE
MC9S12GC96MFUENXP SemiconductorsIC MCU 16BIT 96KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,565
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MC9S12GC96MPBE
MC9S12GC96MPBENXP SemiconductorsIC MCU 16BIT 96KB FLASH 52TQFPMicrocontrollers52-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-TQFP (10×10)
Package / Case:
52-LQFP
601
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MC9S12H128VFVE
MC9S12H128VFVENXP SemiconductorsIC MCU 16BIT 128KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
LCD, POR, PWM, WDT
Number of I/O:
99
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
196
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MC9S12H128VPVE
MC9S12H128VPVENXP SemiconductorsIC MCU 16BIT 128KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
LCD, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
611
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MC9S12H256VFVE
MC9S12H256VFVENXP SemiconductorsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
LCD, POR, PWM, WDT
Number of I/O:
99
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
571
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MC9S12H256VFVER
MC9S12H256VFVERNXP SemiconductorsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
LCD, POR, PWM, WDT
Number of I/O:
99
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
10
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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