Microcontrollers

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Total Products: 76,657
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MSP430G2353IRHB32RMSP430G2353IRHB32RTexas InstrumentsIC MCU 16BIT 4KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
203
MSP430G2353IRHB32TMSP430G2353IRHB32TTexas InstrumentsIC MCU 16BIT 4KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,129
MSP430G2402IN20MSP430G2402IN20Texas InstrumentsIC MCU 16BIT 8KB FLASH 20DIPMicrocontrollers20-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-PDIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
481
MSP430G2402IPW14MSP430G2402IPW14Texas InstrumentsIC MCU 16BIT 8KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
1,137
MSP430G2402IPW14RMSP430G2402IPW14RTexas InstrumentsIC MCU 16BIT 8KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
161
MSP430G2402IPW20MSP430G2402IPW20Texas InstrumentsIC MCU 16BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
300
MSP430G2402IPW20RMSP430G2402IPW20RTexas InstrumentsIC MCU 16BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
371
MSP430G2402IRSA16RMSP430G2402IRSA16RTexas InstrumentsIC MCU 16BIT 8KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,395
MSP430G2402IRSA16TMSP430G2402IRSA16TTexas InstrumentsIC MCU 16BIT 8KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,279
MSP430G2403IN20MSP430G2403IN20Texas InstrumentsIC MCU 16BIT 8KB FLASH 20DIPMicrocontrollers20-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-PDIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
191
MSP430G2403IPW20MSP430G2403IPW20Texas InstrumentsIC MCU 16BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
597
MSP430G2403IPW20RMSP430G2403IPW20RTexas InstrumentsIC MCU 16BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
743
MSP430G2403IPW28MSP430G2403IPW28Texas InstrumentsIC MCU 16BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, PWM, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
193
MSP430G2403IPW28RMSP430G2403IPW28RTexas InstrumentsIC MCU 16BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, PWM, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
897
MSP430G2403IRHB32RMSP430G2403IRHB32RTexas InstrumentsIC MCU 16BIT 8KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, PWM, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
146
MSP430G2403IRHB32TMSP430G2403IRHB32TTexas InstrumentsIC MCU 16BIT 8KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, PWM, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,508
MSP430G2412IN20MSP430G2412IN20Texas InstrumentsIC MCU 16BIT 8KB FLASH 20DIPMicrocontrollers20-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-PDIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
1,033
MSP430G2412IPW14MSP430G2412IPW14Texas InstrumentsIC MCU 16BIT 8KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
37
MSP430G2412IPW14RMSP430G2412IPW14RTexas InstrumentsIC MCU 16BIT 8KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
1,527
MSP430G2412IPW20MSP430G2412IPW20Texas InstrumentsIC MCU 16BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
1,892

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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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