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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,658
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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R7F7016493AFD-C#BA1N/AR7F7016493AFD-C#BA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,219
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R7F7016493AFD-C#KA1N/AR7F7016493AFD-C#KA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
883
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R7F7016493AFE-C#BA1N/AR7F7016493AFE-C#BA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
390
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R7F7016493AFE-C#KA1N/AR7F7016493AFE-C#KA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
705
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R7F7016493AFP-C#AA1
R7F7016493AFP-C#AA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
624
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R7F7016493AFP-C#BA1
R7F7016493AFP-C#BA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFPN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP
Package / Case:
176-QFP
1,257
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R7F7016493AFP-C#KA1
R7F7016493AFP-C#KA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFPN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP
Package / Case:
176-QFP
1,556
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R7F7016503ABG-C#BC1
R7F7016503ABG-C#BC1RenesasIC MCU 32BIT 3MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
174
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
631
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R7F7016503ABG-C#HC1
R7F7016503ABG-C#HC1Renesas32BIT MCU RH850/F1KMMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
174
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38×10, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
732
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R7F7016513ABG-C#AC1
R7F7016513ABG-C#AC1RenesasIC MCU 32BIT 4MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, FIFO, FlexRay, I2C, LINbus, SENT, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
174
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
544K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
1,686
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N/A
R7F7016513ABG-C#BC1RenesasIC MCU 32BIT 4MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
112
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N/A
R7F7016513ABG-C#HC1RenesasIC MCU 32BIT 4MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
1,839
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R7F7016514ABG-C#AC1
R7F7016514ABG-C#AC1RenesasIC MCU 32BIT 4MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
470
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N/A
R7F7016514ABG-C#BC1RenesasIC MCU 32BIT 4MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
1,876
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R7F7016514ABG-C#HC1
R7F7016514ABG-C#HC1RenesasIC MCU 32BIT 4MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
622
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R7F7016523ABG-C#BC1
R7F7016523ABG-C#BC1RenesasIC MCU 32BIT 3MB FLASH 272FBGAMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
214
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
343
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R7F7016523ABG-C#HC1
R7F7016523ABG-C#HC1Renesas32BIT MCU RH850/F1KMMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
214
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38×10, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
254
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R7F7016533ABG-C#AC1
R7F7016533ABG-C#AC1RenesasIC MCU 32BIT 4MB FLASH 272FBGAMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, FIFO, FlexRay, I2C, LINbus, SENT, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
214
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
544K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
179
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R7F7016533ABG-C#BC1
R7F7016533ABG-C#BC1RenesasIC MCU 32BIT 4MB FLASH 272FBGAMicrocontrollers272-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
214
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-FBGA (17×17)
Package / Case:
272-FBGA
834
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R7F7016533ABG-C#HC1
R7F7016533ABG-C#HC1RenesasIC MCU 32BIT 4MB FLASH 272FPBGAMicrocontrollers272-FPBGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
214
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
272-FPBGA
Package / Case:
272-BGA
736
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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