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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,658
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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R7F7016934AFP-C#AA1
R7F7016934AFP-C#AA1RenesasIC MCU 32BIT 1MB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
33
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x10b, 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
639
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R7F7016934AFP-C#BA1
R7F7016934AFP-C#BA1RenesasIC MCU 32BIT 1MB FLASH 48LFQFPMicrocontrollers48-LFQFPN/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
33
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x10b, 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP
Package / Case:
48-QFP
644
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R7F7016934AFP-C#KA1
R7F7016934AFP-C#KA1RenesasIC MCU 32BIT 1MB FLASH 48LFQFPMicrocontrollers48-LFQFPN/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
33
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x10b, 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP
Package / Case:
48-QFP
1,530
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R7F7016943AFP-C#BA1
R7F7016943AFP-C#BA1RenesasIC MCU 32BIT 768KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
33
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x10b, 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
666
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R7F7016943AFP-C#KA1
R7F7016943AFP-C#KA1Renesas32BIT MCU RH850/F1KM T&RMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
33
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x10b, 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
977
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R7F7016953AFP-C#BA1
R7F7016953AFP-C#BA1RenesasIC MCU 32BIT 512KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
33
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x10b, 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,109
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R7F7016953AFP-C#KA1
R7F7016953AFP-C#KA1Renesas32BIT MCU RH850/F1KM-S1 512KB QFMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
33
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x10b, 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
777
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R7F7017083AFP-C#BA1
R7F7017083AFP-C#BA1RenesasIC MCU 32BIT 6MB FLASH 176LQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
896K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,282
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R7F7017083AFP-C#KA1
R7F7017083AFP-C#KA1Renesas32BIT MCU RH850/F1KH-D8 CU QFP17Microcontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
896K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,474
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R7F7017093AFP-C#AA1
R7F7017093AFP-C#AA1RenesasIC MCU 32BIT 8MB FLASH 176LFQFPMicrocontrollers176-LFQFPN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP
Package / Case:
176-QFP
1,139
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R7F7017093AFP-C#BA1
R7F7017093AFP-C#BA1RenesasIC MCU 32BIT 8MB FLASH 176LQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,333
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R7F7017093AFP-C#KA1
R7F7017093AFP-C#KA1RenesasIC MCU 32BIT 8MB FLASH 176LFQFPMicrocontrollers176-LFQFPN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP
Package / Case:
176-QFP
993
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R7F7017103ABG-C#BC1
R7F7017103ABG-C#BC1RenesasIC MCU 32BIT 6MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
896K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
1,033
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R7F7017103ABG-C#HC1
R7F7017103ABG-C#HC1Renesas32BIT MCU RH850/F1KH-D8Microcontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
896K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
330
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R7F7017113ABG-C#AC1
R7F7017113ABG-C#AC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, FIFO, FlexRay, I2C, LINbus, SENT, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.03M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
970
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N/A
R7F7017113ABG-C#BC1RenesasIC MCU 32BIT 8MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
1,211
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R7F7017113ABG-C#HC1
R7F7017113ABG-C#HC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
992K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
377
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R7F7017114ABG-C#AC1
R7F7017114ABG-C#AC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
1,831
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N/A
R7F7017114ABG-C#BC1RenesasIC MCU 32BIT 8MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
1,443
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R7F7017114ABG-C#HC1
R7F7017114ABG-C#HC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
65
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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