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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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R7FA6M4AD3CFM#AA0
R7FA6M4AD3CFM#AA0RenesasIC MCU 32BIT 512KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
41
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
140
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R7FA6M4AD3CFM#AA5
R7FA6M4AD3CFM#AA5RenesasMCU RA6 ARM CM33 200MHZ 512K/256Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
41
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
62
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R7FA6M4AD3CFM#BA0
R7FA6M4AD3CFM#BA0RenesasMCU RA6 ARM CM33 200MHZ 512K/256Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
41
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,167
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R7FA6M4AD3CFP#AA0
R7FA6M4AD3CFP#AA0RenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
819
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R7FA6M4AD3CFP#AA5
R7FA6M4AD3CFP#AA5RenesasMCU RA6 ARM CM33 200MHZ 512K/256Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
268
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R7FA6M4AD3CFP#BA0
R7FA6M4AD3CFP#BA0RenesasMCU RA6 ARM CM33 200MHZ 512K/256Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,362
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R7FA6M4AD3CFP#HA0
R7FA6M4AD3CFP#HA0RenesasMCU RA6 ARM CM33 200MHZ 512K/256Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
496
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R7FA6M4AE2CBM#BC0
R7FA6M4AE2CBM#BC0RenesasMCU RA6 ARM CM33 200MHZ 768K/256Microcontrollers144-LFBGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFBGA (7×7)
Package / Case:
144-LFBGA
780
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R7FA6M4AE2CBQ#BC0
R7FA6M4AE2CBQ#BC0RenesasMCU RA6 ARM CM33 200MHZ 768K/256Microcontrollers64-LFBGA (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
45
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFBGA (6×6)
Package / Case:
64-LFBGA
951
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N/A
R7FA6M4AE3CBM#BC0RenesasMCU RA6 ARM CM33 200MHZ 768K/256Microcontrollers144-LFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFBGA (7×7)
Package / Case:
144-LFBGA
716
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N/A
R7FA6M4AE3CBQ#BC0RenesasMCU RA6 ARM CM33 200MHZ 768K/256Microcontrollers64-LFBGA (6x6)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
45
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFBGA (6×6)
Package / Case:
64-LFBGA
904
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R7FA6M4AE3CFB#AA0
R7FA6M4AE3CFB#AA0RenesasIC MCU 32BIT 768KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
917
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N/A
R7FA6M4AE3CFB#BA0RenesasMCU RA6 ARM CM33 200MHZ 768K/256Microcontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
467
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R7FA6M4AE3CFM#AA0
R7FA6M4AE3CFM#AA0RenesasIC MCU 32BIT 768KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
41
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
979
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QUOTE
R7FA6M4AE3CFM#BA0
R7FA6M4AE3CFM#BA0RenesasMCU RA6 ARM CM33 200MHZ 768K/256Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
41
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
72
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R7FA6M4AE3CFP#AA0
R7FA6M4AE3CFP#AA0RenesasIC MCU 32BIT 768KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
843
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QUOTE
R7FA6M4AE3CFP#BA0
R7FA6M4AE3CFP#BA0RenesasMCU RA6 ARM CM33 200MHZ 768K/256Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,947
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QUOTE
R7FA6M4AE3CFP#HA0
R7FA6M4AE3CFP#HA0RenesasMCU RA6 ARM CM33 200MHZ 768K/256Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
235
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QUOTE
R7FA6M4AF2CBM#BC0
R7FA6M4AF2CBM#BC0RenesasMCU:RAMicrocontrollers144-LFBGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFBGA (7×7)
Package / Case:
144-LFBGA
1,292
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QUOTE
R7FA6M4AF2CBQ#BC0
R7FA6M4AF2CBQ#BC0RenesasMCU:RAMicrocontrollers64-LFBGA (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
45
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFBGA (6×6)
Package / Case:
64-LFBGA
816
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QUOTE

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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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