Microcontrollers

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Total Products: 76,658
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7S910015CBA#BC0R7S910015CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
295
R7S910015CBG#AC0R7S910015CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
164
R7S910016CBA#BC0R7S910016CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
1,553
R7S910016CBG#AC0R7S910016CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
1,960
R7S910017CBA#BC0R7S910017CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
1,657
R7S910017CBG#AC0R7S910017CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
1,038
R7S910018CBA#BC0R7S910018CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
89
R7S910018CBG#AC0R7S910018CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
416
N/AR7S910020CBG#AC0RenesasRZ/T1-M 450MHZ ROML 544K MDIO SLMicrocontrollers112-FBGA (6x6)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
112-FBGA (6×6)
Package / Case:
112-LFBGA
1,720
N/AR7S910021CBG#AC0RenesasRZ/T1-M 450MHZ ROML 1568K MDIO SMicrocontrollers112-FBGA (6x6)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
RAM Size:
1.568M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
112-FBGA (6×6)
Package / Case:
112-LFBGA
840
N/AR7S910022CBG#AC0RenesasRZ/T1-M 450MHZ ROML 544K MDIO SLMicrocontrollers112-FBGA (6x6)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
112-FBGA (6×6)
Package / Case:
112-LFBGA
1,748
N/AN/AR7S910023CBG#AC0RenesasIC MCU 32BIT ROMLESS 112LFBGAMicrocontrollers112-FBGA (6x6)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
RAM Size:
1.568M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
112-FBGA (6×6)
Package / Case:
112-LFBGA
1,032
R7S910025CBA#BC0R7S910025CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
1,712
R7S910025CBG#AC0R7S910025CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
112
R7S910026CBA#BC0R7S910026CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
286
R7S910026CBG#AC0R7S910026CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
933
R7S910027CBA#BC0R7S910027CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
938
R7S910027CBG#AC0R7S910027CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
389
R7S910028CBA#BC0R7S910028CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
690
R7S910028CBG#AC0R7S910028CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
1,298

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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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