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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,308
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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SPC5517EBVLQ66
SPC5517EBVLQ66NXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
878
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SPC5517EBVLQ66R
SPC5517EBVLQ66RNXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
586
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SPC5517GAMMG66
SPC5517GAMMG66NXP SemiconductorsIC MCU 32B 1.5MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
985
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SPC5517GAVMG80
SPC5517GAVMG80NXP SemiconductorsIC MCU 32B 1.5MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
833
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SPC5517SAMLU66
SPC5517SAMLU66NXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z1
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
137
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
865
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SPC5517SBMLQ66
SPC5517SBMLQ66NXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z1
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,516
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SPC5534MVM80N/ASPC5534MVM80NXP SemiconductorsIC MCU 32BIT 1MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
192
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 34x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
12
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SPC5534MVM80RN/ASPC5534MVM80RNXP SemiconductorsIC MCU 32BIT 1MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
192
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 34x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,466
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SPC5534MVZ80N/ASPC5534MVZ80NXP SemiconductorsIC MCU 32BIT 1MB FLASH 324PBGAMicrocontrollers324-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-PBGA (23×23)
Package / Case:
324-BBGA
842
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SPC5553MVZ132
SPC5553MVZ132NXP SemiconductorsIC MCU 32BIT 1.5KB FLASH 324PBGAMicrocontrollers324-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-PBGA (23×23)
Package / Case:
324-BBGA
970
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SPC5554MVR132N/ASPC5554MVR132NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
599
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SPC5566MVR132
SPC5566MVR132NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
802
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SPC5566MVR132R
SPC5566MVR132RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,299
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SPC5566MVR144
SPC5566MVR144NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
144MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
93
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N/AN/ASPC5566MVR144RNXP SemiconductorsNXP 32-BIT MCU, POWER ARCH CORE,Microcontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit
Speed:
144MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,044
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SPC5566MZP112R
SPC5566MZP112RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
248
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SPC5566MZP132
SPC5566MZP132NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,022
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SPC5566MZP132R
SPC5566MZP132RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,641
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SPC5566MZP144
SPC5566MZP144NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
144MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
613
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SPC5566MZP144R
SPC5566MZP144RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
144MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,526
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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