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Microcontrollers
Total Products: 76,658
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | N/A | SP5748GSK0AMKU6R | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,549 | |
 | N/A | SP5748GSK0AMMJ6R | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 222 | |
 | N/A | SP5748GSK0AVKU2R | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,246 | |
 | N/A | SP5748GSK0AVMJ2R | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 1,287 | |
 | SP5748GTK0AMKU6R | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 102 | ||
 | N/A | SP5748GTK0AMMJ6R | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 1,643 | |
 | SPC5121YVY400B | NXP Semiconductors | IC MCU 32BIT ROMLESS 516TEPBGA | Microcontrollers | 516-TEPBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: e300 Core Size: 32-Bit Single-Core Speed: 400MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Peripherals: DMA, WDT Number of I/O: 147 Program Memory Type: ROMless RAM Size: 128K x 8 Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-TEPBGA (27×27) Package / Case: 516-BBGA Exposed Pad | 696 | ||
 | SPC5123YVY400B | NXP Semiconductors | IC MCU 32BIT ROMLESS 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: e300 Core Size: 32-Bit Single-Core Speed: 400MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Peripherals: DMA, WDT Number of I/O: 147 Program Memory Type: ROMless RAM Size: 128K x 8 Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) Package / Case: 516-BBGA | 36 | ||
 | SPC5125YVN400 | NXP Semiconductors | IC MCU 32BIT ROMLESS 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C | Core Processor: e300 Core Size: 32-Bit Single-Core Speed: 400MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Peripherals: DMA, WDT Number of I/O: 64 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) Package / Case: 324-BBGA | 810 | ||
 | N/A | SPC5125YVN400R | NXP Semiconductors | IC MCU 32BIT ROMLESS 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TJ) | Core Processor: e300 Core Size: 32-Bit Single-Core Speed: 400MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Peripherals: DMA, WDT Number of I/O: 64 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) Package / Case: 324-BBGA | 265 | |
 | N/A | SPC5514EAMLQ66 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 1,391 | |
 | SPC5514EBMLQ66 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 260 | ||
 | SPC5514EBVLQ66 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 1,502 | ||
 | SPC5514GBMLQ66 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 221 | ||
 | SPC5515SAMLU66 | NXP Semiconductors | IC MCU 32BIT 768KB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z1 Core Size: 32-Bit Single-Core Speed: 66MHz Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 137 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP | 1,601 | ||
 | SPC5515SBMLQ66 | NXP Semiconductors | IC MCU 32BIT 768KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z1 Core Size: 32-Bit Single-Core Speed: 66MHz Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 1,999 | ||
 | SPC5516EACMG48 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 48MHz Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 144 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) Package / Case: 208-BGA | 1,070 | ||
 | N/A | SPC5516EAMLQ48 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 136 | |
 | SPC5516EAMMG66 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 144 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) Package / Case: 208-BGA | 797 | ||
 | SPC5516EAVLQ66R | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 1,190 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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