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Microcontrollers
Total Products: 76,658
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | SPC5746CHK0AMMH6 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) Package / Case: 100-LFBGA | 953 | ||
 | SPC5746CHK0AMMJ6 | NXP Semiconductors | IC MCU 32BIT 3MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 79 | ||
| N/A | N/A | SPC5746CHK1ACKU6 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI Peripherals: DMA, I2S, LVD/HVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 68x10b, 31x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,172 | |
 | SPC5746CHK1ACMJ6 | NXP Semiconductors | IC MCU 32BIT 3MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 614 | ||
 | SPC5746CHK1AMKU6 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 918 | ||
 | SPC5746CHK1AMMH6 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI Peripherals: DMA, I2S, LVD/HVD, POR, WDT Number of I/O: 65 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 68x10b, 31x12b SAR Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) Package / Case: 100-LBGA | 211 | ||
 | SPC5746CHK1AMMJ6 | NXP Semiconductors | IC MCU 32BIT 3MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 349 | ||
 | SPC5746CHK1AVKU6 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,247 | ||
 | SPC5746CK1AMKU2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 632 | ||
 | SPC5746CK1AMKU2R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,360 | ||
 | SPC5746CK1AMKU6 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 403 | ||
 | SPC5746CK1AMKU6R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 181 | ||
 | SPC5746CK1AMMJ6 | NXP Semiconductors | IC MCU 32BIT 3MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 1,249 | ||
 | SPC5746CK1AMMJ6R | NXP Semiconductors | IC MCU 32BIT 3MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 725 | ||
| N/A | N/A | SPC5746CK1AVKU6 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI Peripherals: DMA, I2S, LVD/HVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 68x10b, 31x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,900 | |
 | SPC5746CK1MKU2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 218 | ||
 | SPC5746CK1MKU6 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,911 | ||
 | SPC5746CK1MMJ6 | NXP Semiconductors | IC MCU 32BIT 3MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 1,462 | ||
 | SPC5746CK1MMJ6R | NXP Semiconductors | IC MCU 32BIT 3MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 671 | ||
 | SPC5746CSK1AMKU6 | NXP Semiconductors | MPC5746C - 32 BIT,DUAL CORE,3M F | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI Peripherals: DMA, I2S, LVD/HVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 68x10b, 31x12b SAR Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 272 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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