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Microcontrollers
Total Products: 76,658
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | SPC5747CK1VMJ6 | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 1,704 | ||
 | SPC5747CK1VMJ6R | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 72 | ||
 | N/A | SPC5747CSK0AMKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,766 | |
 | SPC5747CSK0AVMJ2 | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 120MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 787 | ||
 | SPC5747GBK1VMJ6 | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 226 | ||
 | SPC5747GK0AMMJ6 | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 1,420 | ||
| N/A | N/A | SPC5747GK0AVKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3.15V ~ 3.6V, 3.15V ~ 5.5V Data Converters: A/D 80x10b, 64x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 534 | |
 | SPC5747GK1CKU2 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 524 | ||
 | SPC5747GK1CKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,924 | ||
 | SPC5747GK1MKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 588 | ||
 | SPC5747GK1MKU6R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,358 | ||
 | SPC5747GK1MMJ6 | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 327 | ||
 | SPC5747GK1MMJ6R | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 492 | ||
 | SPC5747GSK1MKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 495 | ||
 | SPC5747GSK1MKU6R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 778 | ||
 | N/A | SPC5747GTK0AMKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 385 | |
 | N/A | SPC5747GTK1MKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 532 | |
 | N/A | SPC5747GTK1MKU6R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 151 | |
| N/A | SPC5748CBK0AMKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 289 | ||
| N/A | N/A | SPC5748CBK0AMMJ6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 256LBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI Peripherals: DMA, FlexRay, I2S, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x10b, 80x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 950 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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