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Microcontrollers
Total Products: 76,658
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | SPC5748GSK1MKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,458 | ||
 | SPC5748GSK1MKU6R | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 189 | ||
 | SPC5748GSK1MMJ6 | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit 3-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, I2S, LVD/HVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: 192K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 429 | ||
| N/A | N/A | SPC5748GSK1MMJ6R | NXP Semiconductors | NXP 32-BIT MCU, TRIPLE CORE, 6MB | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG Peripherals: DMA, LVD, I2S, POR, WDT Number of I/O: 246 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V Data Converters: A/D 80x10b, 64x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 624 | |
 | SPC5748GSK1MMN6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 324MAPBGA | Microcontrollers | 324-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 246 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-MAPBGA (19×19) Package / Case: 324-LBGA | 317 | ||
 | SPC5748GTK0AMKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 398 | ||
 | N/A | SPC5748GTK0AMMJ6 | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 951 | |
| N/A | SPC5748GTK0AVKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,871 | ||
 | SPC5748GTK1MMJ6 | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 797 | ||
 | SPC5748GTK1MMJ6R | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) Package / Case: 256-LBGA | 1,134 | ||
 | SPC574K72E5C6FAR | STMicroelectronics | IC MCU 32BIT 2.5MB FLSH 144ETQFP | Microcontrollers | 144-eTQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 12b SAR, 16b Sigma-Delta Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 144-eTQFP (20×20) Package / Case: 144-TQFP Exposed Pad | 850 | ||
 | SPC574K72E5C6FAY | STMicroelectronics | IC MCU 32BIT 2.5MB FLSH 144ETQFP | Microcontrollers | 144-eTQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 12b SAR, 16b Sigma-Delta Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 144-eTQFP (20×20) Package / Case: 144-TQFP Exposed Pad | 1,185 | ||
 | SPC574K72E7C6FAR | STMicroelectronics | IC MCU 32BIT 2.5MB FLSH 176ELQFP | Microcontrollers | 176-eLQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 12b SAR, 16b Sigma-Delta Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 176-eLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 359 | ||
 | SPC574K72E7C6FAY | STMicroelectronics | IC MCU 32BIT 2.5MB FLSH 176ELQFP | Microcontrollers | 176-eLQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 12b SAR, 16b Sigma-Delta Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 176-eLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 798 | ||
 | SPC574S60E3CE0AR | STMicroelectronics | IC MCU 32BIT 1MB FLASH 100ETQFP | Microcontrollers | 100-eTQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 140MHz Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: 64 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage – Supply (Vcc/Vdd): 3.135V ~ 5.25V Data Converters: A/D 32x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 100-eTQFP (14×14) Package / Case: 100-TQFP Exposed Pad | 637 | ||
 | SPC574S60E3CE0AY | STMicroelectronics | IC MCU 32BIT 1MB FLASH 100ETQFP | Microcontrollers | 100-eTQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 140MHz Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: 64 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage – Supply (Vcc/Vdd): 3.135V ~ 5.25V Data Converters: A/D 32x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 100-eTQFP (14×14) Package / Case: 100-TQFP Exposed Pad | 228 | ||
 | SPC574S64E3CEFAR | STMicroelectronics | IC MCU 32BIT 1.5MB FLSH 100ETQFP | Microcontrollers | 100-eTQFP (14x14) | 3.135V - 5.25V | -40°C – 125°C | Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 140MHz Program Memory Size: 1.5MB (1.5M x 8) Mounting Type: Surface Mount | 472 | ||
 | SPC574S64E3CEFAY | STMicroelectronics | IC MCU 32BIT 1.5MB FLSH 100ETQFP | Microcontrollers | 100-eTQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 140MHz Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: 64 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage – Supply (Vcc/Vdd): 3.135V ~ 5.25V Data Converters: A/D 32x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 100-eTQFP (14×14) Package / Case: 100-TQFP Exposed Pad | 27 | ||
 | SPC5775BDK3MME2 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z7 Core Size: 32-Bit Dual-Core Speed: 220MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: 293 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 40x12b eQADCx2 Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) Package / Case: 416-BGA | 728 | ||
| N/A | N/A | SPC5775BDK3MME2R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z7 Core Size: 32-Bit Dual-Core Speed: 220MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, LINbus, SPI, PSI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage – Supply (Vcc/Vdd): 3V, 5.5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) Package / Case: 416-BGA | 541 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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