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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,658
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/A
SPC58NH92C3RMI0XSTMicroelectronicsIC MCU 32BIT 10MB FLASH 302FPBGAMicrocontrollers302-FPBGA (17x17)1.2V–
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Program Memory Size:
10MB (10M x 8)
Mounting Type:
Surface Mount
71
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N/AN/ASPC58NH92C3RMI0YSTMicroelectronicsIC MCU 32BIT 10MB FLASH 302BGAMicrocontrollers302-FPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
205
Program Memory Size:
10MB (10M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.25M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 96×10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
302-FPBGA (17×17)
Package / Case:
302-BGA
192
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N/AN/ASPC58NH92C5HMI0XSTMicroelectronicsIC MCU 32BIT 10MB FLASH 386FBGAMicrocontrollers386-FPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
205
Program Memory Size:
10MB (10M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.25M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 96×10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
386-FPBGA (19×19)
Package / Case:
386-FBGA
662
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N/A
SPC58NH92C5RMI0XSTMicroelectronicsIC MCU 32BIT 10MB FLASH 386FPBGAMicrocontrollers386-FPBGA (19x19)N/A–
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals:
DMA
Program Memory Size:
10MB (10M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.0625M x 8
Voltage – Supply (Vcc/Vdd):
1.2V
Data Converters:
A/D 100x12b
Oscillator Type:
Internal
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
386-FPBGA (19×19)
Package / Case:
386-FBGA
455
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N/AN/ASPC58NH92C5RMI0YSTMicroelectronicsIC MCU 32BIT 10MB FLASH 386FBGAMicrocontrollers386-FPBGA (19x19)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
205
Program Memory Size:
10MB (10M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.25M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 96×10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
386-FPBGA (19×19)
Package / Case:
386-FBGA
617
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N/AN/ASPC58NH92E7HMI0XSTMicroelectronicsIC MCU 32BIT 10MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
154
Program Memory Size:
10MB (10M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.25M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 96×10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
429
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SPC58NH92E7RMI0X
SPC58NH92E7RMI0XSTMicroelectronicsIC MCU 32BIT 10MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)1.2V–
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Program Memory Size:
10MB (10M x 8)
Mounting Type:
Surface Mount
748
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N/AN/ASPC58NH92E7RMI0YSTMicroelectronicsIC MCU 32BIT 10MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
154
Program Memory Size:
10MB (10M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.25M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 96×10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,314
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SPC58NN84C3RMHBR
SPC58NN84C3RMHBRSTMicroelectronicsIC MCU 32BIT 6MB FLASH 292FPBGAMicrocontrollers292-FPBGA (17x17)1.14V - 1.26V, 3V - 5.5V-40°C – 150°C
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Program Memory Size:
6MB (6M x 8)
Mounting Type:
Surface Mount
1,564
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SPC58NN84C3RMHBYN/ASPC58NN84C3RMHBYSTMicroelectronicsIC MCU 32BIT 6MB FLASH 292FPBGAMicrocontrollers292-FPBGA (17x17)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, WDT
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V, 3V ~ 5.5V
Data Converters:
A/D 10b, 12b, 16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
292-FPBGA (17×17)
Package / Case:
292-FBGA
190
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SPC58NN84C3RSHBRN/ASPC58NN84C3RSHBRSTMicroelectronicsIC MCU 32BIT 6MB FLASH 292FPBGAMicrocontrollers292-FPBGA (17x17)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, WDT
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V, 3V ~ 5.5V
Data Converters:
A/D 10b, 12b, 16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
292-FPBGA (17×17)
Package / Case:
292-FBGA
608
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SPC58NN84E7RMHARN/ASPC58NN84E7RMHARSTMicroelectronicsIC MCU 32BIT 6MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, WDT
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V, 3V ~ 5.5V
Data Converters:
A/D 10b, 12b, 16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
519
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SPC58NN84E7RMHAYN/ASPC58NN84E7RMHAYSTMicroelectronicsIC MCU 32BIT 6MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, WDT
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V, 3V ~ 5.5V
Data Converters:
A/D 10b, 12b, 16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
232
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SPC58NN84E7RMHBR
SPC58NN84E7RMHBRSTMicroelectronicsIC MCU 32BIT 6MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)1.14V - 1.26V, 3V - 5.5V-40°C – 150°C
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Program Memory Size:
6MB (6M x 8)
Mounting Type:
Surface Mount
883
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SPC58NN84E7RMHBYN/ASPC58NN84E7RMHBYSTMicroelectronicsIC MCU 32BIT 6MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, WDT
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V, 3V ~ 5.5V
Data Converters:
A/D 10b, 12b, 16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
920
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SPC58NN84E7RSHARN/ASPC58NN84E7RSHARSTMicroelectronicsIC MCU 32BIT 6MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, WDT
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V, 3V ~ 5.5V
Data Converters:
A/D 10b, 12b, 16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,086
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SPC58NN84E7RSHBRN/ASPC58NN84E7RSHBRSTMicroelectronicsIC MCU 32BIT 6MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, WDT
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V, 3V ~ 5.5V
Data Converters:
A/D 10b, 12b, 16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,680
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SPC58NN84E7YMHBRN/ASPC58NN84E7YMHBRSTMicroelectronicsIC MCU 32BIT 6MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, WDT
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V, 3V ~ 5.5V
Data Converters:
A/D 10b, 12b, 16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
873
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N/AN/ASR5E1E370C30F00XSTMicroelectronicsTQFP 100 14X14X1.0 1.0 EXPADDOWNMicrocontrollers100-eTQFP (14x14)3.15V - 3.45V-40°C – 125°C
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
300MHz
Program Memory Size:
2MB (2M x 8)
Mounting Type:
Surface Mount
1,601
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N/AN/ASR5E1E570C30F00XSTMicroelectronicsTQFP 144 20X20X1.0 1.0 EXPADDOWNMicrocontrollers144-eTQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
300MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, PWM, Temp Sensor, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
488K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 3.45V
Data Converters:
A/D 40x12b SAR, 4x16b Sigma-Delta; D/A 10x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-eTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
646
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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