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Microcontrollers
Total Products: 76,307
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | TC324LP16F160FAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 160MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 152K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 46 | ||
 | TC324LP16F160FAALXUMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 150°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 160MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 152K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 1,066 | ||
 | TC327LP16F160SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-11 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 160MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 152K x 8 Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 16 SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-11 Package / Case: 292-LFBGA | 202 | ||
 | TC327LP16F160SAALXUMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-11 | N/A | -40°C ~ 150°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 160MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 152K x 8 Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 16 SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-11 Package / Case: 292-LFBGA | 1,026 | ||
 | TC332LP32F200FAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 242 | ||
 | TC332LP32F200FAALXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 150°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 17 | ||
 | TC332LP32F300FAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 300MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 1,959 | ||
 | TC333LP32F200FAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 504 | ||
 | TC333LP32F200FAALXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 150°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 315 | ||
 | TC333LP32F300FAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 300MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 156 | ||
 | TC334LP32F200FAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 1,371 | ||
 | TC334LP32F200FAALXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 150°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 1,237 | ||
 | TC334LP32F300FAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 300MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 805 | ||
 | TC336DA32F200SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 180LFBGA | Microcontrollers | PG-LFBGA-180-1 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT Peripherals: DMA, I2S, LVDS, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 1.54K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-180-1 Package / Case: 180-LFBGA | 654 | ||
 | TC336DA32F300SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 180LFBGA | Microcontrollers | PG-LFBGA-180-1 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 300MHz Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT Peripherals: DMA, I2S, LVDS, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 1.54K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-180-1 Package / Case: 180-LFBGA | 217 | ||
 | TC336LP32F200SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 180LFBGA | Microcontrollers | PG-LFBGA-180-1 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-180-1 Package / Case: 180-LFBGA | 787 | ||
 | TC336LP32F200SAALXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 180LFBGA | Microcontrollers | PG-LFBGA-180-1 | N/A | -40°C ~ 150°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-180-1 Package / Case: 180-LFBGA | 1,343 | ||
 | TC336LP32F300SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 180LFBGA | Microcontrollers | PG-LFBGA-180-1 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 300MHz Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 248K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-180-1 Package / Case: 180-LFBGA | 38 | ||
 | TC337DA32F200SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT Peripherals: DMA, I2S, LVDS, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 1.54K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 Package / Case: 292-LFBGA | 1,320 | ||
 | TC337DA32F300SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Processor: TriCore™ Core Size: 32-Bit Single-Core Speed: 300MHz Connectivity: ASC, CANbus, Ethernet, FlexRay, LINbus, QSPI, SENT Peripherals: DMA, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 1.53K x 8 Voltage – Supply (Vcc/Vdd): 3.3V, 5V Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 Package / Case: 292-LFBGA | 637 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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