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Microcontrollers
Total Products: 76,308
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | TMS320F28375SPZPS | Texas Instruments | IC MCU 32BIT 1MB FLASH 100HTQFP | Microcontrollers | 100-HTQFP (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: C28x Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 41 Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH RAM Size: 82K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 14x12b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 100-HTQFP (14×14) Package / Case: 100-TQFP Exposed Pad | 843 | ||
 | TMS320F28375SPZPT | Texas Instruments | IC MCU 32BIT 1MB FLASH 100HTQFP | Microcontrollers | 100-HTQFP (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: C28x Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 41 Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH RAM Size: 82K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 14x12b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 100-HTQFP (14×14) Package / Case: 100-TQFP Exposed Pad | 1,162 | ||
 | TMS320F28375SZWTS | Texas Instruments | IC MCU 32BIT 1MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Processor: C28x Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 169 Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH RAM Size: 82K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 24x12b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) Package / Case: 337-LFBGA | 1,076 | ||
 | TMS320F28375SZWTT | Texas Instruments | IC MCU 32BIT 1MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TJ) | Core Processor: C28x Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 169 Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH RAM Size: 82K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 24x12b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) Package / Case: 337-LFBGA | 397 | ||
 | TMS320F28376DPTPS | Texas Instruments | IC MCU 32BIT 512KB FLSH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Processor: C28x Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 97 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 86K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 20x12b, 9x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 746 | ||
 | TMS320F28376DPTPT | Texas Instruments | IC MCU 32BIT 512KB FLSH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 105°C (TJ) | Core Processor: C28x Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 97 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 86K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 20x12b, 9x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 190 | ||
 | TMS320F28376DZWTS | Texas Instruments | IC MCU 32BIT 512KB FLSH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Processor: C28x Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 169 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 86K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 24x12b, 12x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) Package / Case: 337-LFBGA | 500 | ||
 | TMS320F28376DZWTT | Texas Instruments | IC MCU 32BIT 512KB FLSH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TJ) | Core Processor: C28x Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 169 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 86K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 24x12b, 12x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) Package / Case: 337-LFBGA | 32 | ||
 | TMS320F28376SPTPS | Texas Instruments | IC MCU 32BIT 512KB FLSH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Processor: C28x Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 97 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 66K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 20x12b, 20x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 974 | ||
 | TMS320F28376SPTPT | Texas Instruments | IC MCU 32BIT 512KB FLSH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 105°C (TJ) | Core Processor: C28x Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 97 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 66K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 20x12b, 20x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 708 | ||
 | TMS320F28376SPZPS | Texas Instruments | IC MCU 32BIT 512KB FLSH 100HTQFP | Microcontrollers | 100-HTQFP (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: C28x Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 41 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 66K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 14x12b, 14x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 100-HTQFP (14×14) Package / Case: 100-TQFP Exposed Pad | 1,811 | ||
 | TMS320F28376SPZPT | Texas Instruments | IC MCU 32BIT 512KB FLSH 100HTQFP | Microcontrollers | 100-HTQFP (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: C28x Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 97 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 66K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 20x12b, 20x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 100-HTQFP (14×14) Package / Case: 100-TQFP Exposed Pad | 1,000 | ||
 | TMS320F28376SZWTS | Texas Instruments | IC MCU 32BIT 512KB FLSH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Processor: C28x Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 169 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 66K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 24x12b, 12x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) Package / Case: 337-LFBGA | 993 | ||
 | TMS320F28376SZWTT | Texas Instruments | IC MCU 32BIT 512KB FLSH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TJ) | Core Processor: C28x Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 169 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH RAM Size: 66K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 24x12b, 12x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) Package / Case: 337-LFBGA | 302 | ||
 | TMS320F28377DGWTEP | Texas Instruments | NPI SOPRANO IHR4 RTM 12/31 | Microcontrollers | 337-NFBGA (16x16) | N/A | -55°C ~ 125°C (TA) | Core Processor: C28x Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 169 Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH RAM Size: 102K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 24x12b, 12x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) Package / Case: 337-LFBGA | 79 | ||
 | TMS320F28377DPTPEP | Texas Instruments | IC MCU 32BIT 1MB FLASH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -55°C ~ 125°C (TA) | Core Processor: C28x Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 97 Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH RAM Size: 102K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 20x12b, 9x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 696 | ||
 | TMS320F28377DPTPQ | Texas Instruments | IC MCU 32BIT 1MB FLASH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: C28x Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 97 Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH RAM Size: 102K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 20x12b, 9x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 152 | ||
 | TMS320F28377DPTPS | Texas Instruments | IC MCU 32BIT 1MB FLASH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Processor: C28x Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 97 Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH RAM Size: 102K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 20x12b, 9x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,721 | ||
 | TMS320F28377DPTPT | Texas Instruments | IC MCU 32BIT 1MB FLASH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 105°C (TJ) | Core Processor: C28x Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 97 Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH RAM Size: 102K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 20x12b, 9x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 593 | ||
 | TMS320F28377DZWTQ | Texas Instruments | IC MCU 32BIT 1MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: C28x Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 169 Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH RAM Size: 102K x 16 Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.47V Data Converters: A/D 24x12b, 12x16b; D/A 3x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) Package / Case: 337-LFBGA | 68 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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