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Microcontrollers
Total Products: 76,658
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | CYT3BB8CEBQ0AESGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 148 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 82x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 152 | ||
![]() | N/A | CYT3BB8CEBQ1AEEGS | Infineon Technologies | TRAVEO-2 BODY HIGH-END | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 148 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 82x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 704 | |
![]() | N/A | CYT3BB8CEBQ1AEEGST | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 148 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 64x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 776 | |
![]() | N/A | CYT3BB8CEBQ1AESGS | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 148 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 64x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 550 | |
![]() | N/A | CYT3BB8CEBQ1AESGST | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 148 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 64x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 669 | |
| N/A | CYT3BB8CEBR0AESGST | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, Temp Sensor, WDT Number of I/O: 148 Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 82x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 33 | ||
| N/A | CYT3BB8CEBR1AESGST | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 148 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 64x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 452 | ||
![]() | N/A | CYT3BBBCEBQ0BZEGS | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+/M7 Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 220 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) Package / Case: 272-LFBGA | 210 | |
![]() | CYT3BBBCEBQ0BZEGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 220 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) Package / Case: 272-LFBGA | 1,409 | ||
![]() | CYT3BBBCEBQ0BZSGS | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 220 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) Package / Case: 272-LFBGA | 708 | ||
![]() | CYT3BBBCEBQ0BZSGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 220 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) Package / Case: 272-LFBGA | 328 | ||
| N/A | N/A | CYT3DLABABQ1AESGST | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 216TQFP | Microcontrollers | 216-TQFP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 240MHz Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Number of I/O: 108 Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TQFP Package / Case: 216-QFP | 405 | |
| N/A | N/A | CYT3DLABGBQ1AESGS | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 216TQFP | Microcontrollers | 216-TQFP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 240MHz Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Number of I/O: 108 Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TQFP Package / Case: 216-QFP | 231 | |
| N/A | N/A | CYT3DLABGBQ1AESGST | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 216TQFP | Microcontrollers | 216-TQFP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 240MHz Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Number of I/O: 108 Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TQFP Package / Case: 216-QFP | 1,187 | |
![]() | CYT3DLABHBQ1AESGS | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 216TQFP | Microcontrollers | 216-TQFP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 240MHz Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Number of I/O: 108 Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TQFP Package / Case: 216-QFP | 1,100 | ||
| N/A | N/A | CYT3DLBBEBQ1BZSGS | Infineon Technologies | IC MCU 32BIT 4.063MB FLSH 272BGA | Microcontrollers | 272-BGA | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 240MHz Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Number of I/O: 135 Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA Package / Case: 272-BGA | 1,778 | |
| N/A | N/A | CYT3DLBBGBQ1BZSGS | Infineon Technologies | IC MCU 32BIT 4.063MB FLSH 272BGA | Microcontrollers | 272-BGA | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 240MHz Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Number of I/O: 135 Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA Package / Case: 272-BGA | 805 | |
![]() | CYT3DLBBHBQ1BZSGS | Infineon Technologies | IC MCU 32BIT 4.063MB FLSH 272BGA | Microcontrollers | 272-BGA | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Speed: 240MHz Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Number of I/O: 135 Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA Package / Case: 272-BGA | 946 | ||
| N/A | CYT4BB5CEBQ0AEEGS | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 100QFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 72 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 55x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 1,584 | ||
![]() | CYT4BB5CEBQ0AEEGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 100QFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Speed: 100MHz, 250MHz Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 72 Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH EEPROM Size: 256K x 8 RAM Size: 768K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 55x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 1,175 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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